ADM1066
PRODUCTIONSuper Sequencer® with Margining Control and Auxiliary ADC Inputs
- Part Models
- 5
- 1ku List Price
- Starting From $10.43
Part Details
- Complete supervisory and sequencing solution for up to 10 supplies
- 10 supply fault detectors enable supervision of supplies to <0.5% accuracy at all voltages at 25°C
<1.0 % accuracy across all voltages and temperatures - 5 selectable input attenuators allow supervision of
Supplies up to 14.4 V on VH
Supplies up to 6 V on VP1 to VP4 (VPn) - 5 dual-function inputs, VX1 to VX5 (VXn)
High impedance input to supply fault detector with thresholds between 0.573 V and 1.375 V
General-purpose logic input - Complete voltage-margining solution for 6 voltage rails
10 Programmable Output Drivers (PDO1 To PDO10)
- Open collector with external pull-up
- Push/pull output, driven to VDDCAP or VPn
- Open collector with weak pull-up to VDDCAP or VPn
- Internally charge-pumped high drive for use with external N-FET (PDO1 to PDO6 only)
- 6 voltage output 8-bit DACs (0.300 V to 1.551 V) allow voltage adjustment via dc-to-dc converter trim/feedback node
- 12-bit ADC for readback of all supervised voltages
- 2 auxiliary (single-ended) ADC inputs
- Reference input (REFIN) has 2 input options
Driven directly from 2.048 V (±0.25%) REFOUT pin
More accurate external reference for improved ADC performance - Device powered by the highest of VPn, VH for improved redundancy
Sequencing Engine (SE) Implements State Machine Control Of PDO Outputs
- State changes conditional on input events
- Enables complex control of boards
- Power-up and power-down sequence control
- Fault event handling
- Interrupt generation on warnings
- Watchdog function can be integrated in SE
- Program software control of sequencing through SMBus
The ADM1066 Super Sequencer® is a configurable supervisory/ sequencing device that offers a single-chip solution for supply monitoring and sequencing in multiple-supply systems. In addition to these functions, the ADM1066 integrates a 12-bit ADC and six 8-bit voltage output DACs. These circuits can be used to implement a closed-loop margining system that enables supply adjustment by altering either the feedback node or reference of a dc-to-dc converter using the DAC outputs.
Supply margining can be performed with a minimum of external components. The margining loop can be used for in-circuit testing of a board during production (for example, to verify board functionality at −5% of nominal supplies), or it can be used dynamically to accurately control the output voltage of a dc-to-dc converter.
APPLICATIONS- Central office systems
- Servers/routers
- Multivoltage system line cards
- DSP/FPGA supply sequencing
- In-circuit testing of margined supplies
Documentation
Data Sheet 1
User Guide 1
Application Note 12
Technical Articles 1
Video 1
Circuit Note 1
Product Selector Card 1
Product Selection Guide 2
Analog Dialogue 2
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADM1066ACPZ | 40-Lead LFCSP (6mm x 6mm w/ EP) | ||
| ADM1066ACPZ-REEL7 | 40-Lead LFCSP (6mm x 6mm w/ EP) | ||
| ADM1066ASUZ | 48-Lead TQFP (7mm x 7mm) | ||
| ADM1066ASUZ-REEL | 48-Lead TQFP (7mm x 7mm) | ||
| ADM1066ASUZ-REEL7 | 48-Lead TQFP (7mm x 7mm) |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Nov 10, 2022 - 22_0277 Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages |
||
| ADM1066ACPZ | PRODUCTION | |
| ADM1066ACPZ-REEL7 | PRODUCTION | |
|
Apr 29, 2015 - 14_0049 Conversion of 6x6mm and 7x7mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines |
||
| ADM1066ACPZ | PRODUCTION | |
| ADM1066ACPZ-REEL7 | PRODUCTION | |
|
Jun 25, 2014 - 13_0266 Test Transfer of Select LFCSP Products to STATS ChipPAC China |
||
| ADM1066ACPZ | PRODUCTION | |
| ADM1066ACPZ-REEL7 | PRODUCTION | |
|
Jul 16, 2012 - 10_0241 Conversion of LFCSP Package Outline from Punch to Sawn of Package Sizes 4x4, 5x5, 6x6 and 7x7mm and a Transfer of Assembly Site. |
||
| ADM1066ACPZ | PRODUCTION | |
| ADM1066ACPZ-REEL7 | PRODUCTION | |
|
Jun 17, 2011 - 11_0142 ADM1062, ADM1063, ADM1064, ADM1065, ADM1066, ADM1067, ADM1068, ADM1069 Datasheet Specification Correction |
||
| ADM1066ACPZ | PRODUCTION | |
| ADM1066ACPZ-REEL7 | PRODUCTION | |
| ADM1066ASUZ | PRODUCTION | |
| ADM1066ASUZ-REEL | Obsolete | |
| ADM1066ASUZ-REEL7 | PRODUCTION | |
|
Mar 14, 2011 - 11_0045 Addition of STATSChipPAC Malaysia as an Alternate Test Site for LFCSP packages. |
||
| ADM1066ACPZ | PRODUCTION | |
| ADM1066ACPZ-REEL7 | PRODUCTION | |
|
Jan 5, 2009 - 07_0077 Certification of STATSChipPAC Shanghai, China and AMKOR Philippines as additional sources for Assembly & Test of QFP Packages |
||
| ADM1066ASUZ | PRODUCTION | |
| ADM1066ASUZ-REEL | Obsolete | |
| ADM1066ASUZ-REEL7 | PRODUCTION | |
|
Jan 29, 2014 - 14_0014 ADI Corporate Obsolescence Notice-January 2014 (Standard Products) |
||
| ADM1066ASUZ-REEL | Obsolete | |
This is the most up-to-date revision of the Data Sheet.
Software Resources
Evaluation Kits
ADM1066 Evaluation Board
