HMC329
製造中止HMC329 / HMC329LC3B / HMC329LM3
HMC329: GaAs monolithic microwave integrated circuit (MMIC) double-balanced mixer chip, 25 GHz to 40 GHz
HMC329LC3B: GaAs MMIC fundamental mixer surface mount technology (SMT), 24 GHz to 32 GHz
HMC329LM3: GaAs MMIC double-balanced mixer SMT, 26 GHz to 40 GHz
- 製品モデル
- 6
- 1Ku当たりの価格
- 価格は未定
製品の詳細
- Passive: no dc bias required
- Input IP3
HMC329: 19 dBm
HMC329LC3B: 18 dBm
HMC329LM3: 19 dBm - Local oscillator (LO) to radio frequency (RF) isolation
HMC329: 42 dB
HMC329LC3B: 38 dBm
HMC329LM3: 35 dBm - Small size (HMC329): 0.85 mm × 0.55 mm × 0.1 mm
- Wide intermediate frequency (IF) bandwidth (HMC329LC3B): dc to 8 GHz
- Robust 500 V electrostatic discharge (ESD), Class 1B (HMC329LC3B)
- 12-Lead ceramic 3 mm × 3 mm SMT package (HMC329LC3B): 9 mm2
- Leadless SMT package, 25 mm2 (HMC329LM3)
The HMC329 devices are double-balanced MMIC mixers that are available in a chip (HMC329), a leadless RoHS compliant SMT package (HMC329LC3B), and an SMT leadless chip carrier package (HMC329LM3). The HMC329 devices can be used as an upconverter or downconverter. On the HMC329, the mixer is used as an upconverter or downcnverter in a small chip area of 0.85 mm × 0.55 mm. Excellent isolations are provided by on-chip baluns, and the chip requires no external components and no dc bias. Measurements for the HMC329 were made with the chip mounted and ribbon bonded into in a 50 Ω microstrip test fixture that contains 5 mil alumina substrates between the chip and K connectors. Measured data includes the parasitic effects of the assembly. RF connections to the chip were made with 0.076 mm (3 mil) ribbon bond with minimal length less than 0.31 mm (<12 mil).
Applications
- Microwave point-to-point radios
- Point-to-point radios
- Point-to-multipoint radios and very small aperture terminal (VSAT)
- Local multipoint distribution systems (LMDS)
- Satellite communications (SATCOM)
- Test equipment and sensors
- Military end use
- RADAR
ドキュメント
品質関連資料 2
テープ＆リール仕様 2
| 製品モデル | ピン／パッケージ図 | 資料 | CADシンボル、フットプリント、および3Dモデル |
|---|---|---|---|
| HMC329 | CHIPS OR DIE | ||
| HMC329LC3B | 12-Lead LCC (3mm x 3mm w/ EP) | ||
| HMC329LC3BTR | 12-Lead LCC (3mm x 3mm w/ EP) | ||
| HMC329LC3BTR-R5 | 12-Lead LCC (3mm x 3mm w/ EP) | ||
| HMC329LM3 | LGA/CASON/CH ARRY SO NO LD | ||
| HMC329LM3TR | LGA/CASON/CH ARRY SO NO LD |
| 製品モデル | 製品ライフサイクル | PCN |
|---|---|---|
|
5 24, 2017 - 17_0100 Change in Moisture Sensitivity Level for LM1 and LM3 Packages |
||
| HMC329LM3 | 製造中止 | |
| HMC329LM3TR | 製造中止 | |
|
1 11, 2017 - 16_0010 Discontinuance of Select RF and Microwave Products |
||
| HMC329 | 最終販売 | |
| HMC329LC3B | 最終販売 | |
| HMC329LC3BTR | 最終販売 | |
| HMC329LC3BTR-R5 | 製造中止 | |
| HMC329LM3 | 製造中止 | |
| HMC329LM3TR | 製造中止 | |
これは最新改訂バージョンのデータシートです。
ハードウェア・エコシステム
| 製品モデル | 製品ライフサイクル | 詳細 |
|---|---|---|
| HMC329ALC3B | GaAs、MMIC、ダブル・バランスド・ミキサー、24 ～ 32 GHz | |
| HMC329A-Die | 22 GHz ～ 38 GHz、GaAs MMIC ダブル・バランスド・ミキサー | |
| HMC1106 | 新規設計に推奨 | GaAs MMICミキサー、15GHz～36GHz |