HMC258
製造中止HMC258 / HMC258LC3B
HMC258: sub harmonic mixer chip, 14 GHz to 21 GHz
HMC258LC3B: sub harmonic mixer surface mount technology (SMT), 14.5 GHz to 19.5 GHz
HMC258LM3: sub harmonic mixer SMT, 14 GHz to 20 GHz
- 製品モデル
- 6
- 1Ku当たりの価格
- 価格は未定
製品の詳細
- Integrated local oscillator (LO) amplifier: 0 dBm drive (HMC258)
- Integrated LO amplifier: 0 dBm input (HMC258LC3B and HMC258LM3)
- Sub harmonically pumped (×2) LO
- High 2LO to RF isolation
HMC258: 40 dB
HMC258LC2B: >45 dB
HMC258LM3: >40 dB
- Die size (HMC258): 0.85 mm × 1.15 mm × 0.1 mm
- No External Matching Required (HMC258LC3B)
- RoHS compliant 3 mm × 3 mm ceramic SMT package (HMC258LC3B)
- LM3 SMT package (HMC258LM3)
The HMC258 devices are sub-harmonically pumped (×2) single-ended monolithic microwave integrated circuit (MMIC) mixers with integrated LO amplifiers which can be used as upconverters or downconverters. The HMC258 devices are available in a chip (HMC258), an SMT leadless ceramic package (HMC258LC3B), and an SMT leadless chip carrier package (HMC258LM3). The HMC258 utilizes a GaAs metal semiconductor field effect transistor (MESFET) technology that results in a small overall chip area of 0.9 mm2. The 2LO to RF isolation is excellent, eliminating the need for additional filtering. The LO amplifier is a single bias (5 V) two stage design with only 0 dBm drive requirement.
A less stringent oscillator design is made possible by the low LO drive and sub harmonic nature of the HMC258 chip. All data is with the chip in a 50 Ω test fixture connected via 0.025 mm (1 mil) diameter wire bonds of minimal length less than 0.31 mm (<12 mils). The HMC258LC3B requires no external matching components, making it ideal for integrated subsystem applications. All data for the HMC258LM3 is with the nonhermetic, epoxy sealed LM3 packaged device mounted in a 50 Ω test fixture. Utilizing the HMC258LC3B or the HMC258LM3 eliminates the need for wire bonding, thereby providing a consistent connection interface for the customer.
Applications
- Microwave point-to-point radios
- Very small aperture terminal (VSAT)
- Satellite communications (SATCOM)
- Test and measurement equipment
- Military and space
- 14 GHz and 20 GHz microwave radios (HMC258LM3)
ドキュメント
データシート 2
製造中止品のデータシート 1
品質関連資料 4
テープ＆リール仕様 2
| 製品モデル | ピン／パッケージ図 | 資料 | CADシンボル、フットプリント、および3Dモデル |
|---|---|---|---|
| HMC258 | CHIPS OR DIE | ||
| HMC258LC3B | 12-Lead LCC (3mm x 3mm w/ EP) | ||
| HMC258LC3BTR | 12-Lead LCC (3mm x 3mm w/ EP) | ||
| HMC258LC3BTR-R5 | 12-Lead LCC (3mm x 3mm w/ EP) | ||
| HMC258LM3 | LGA/CASON/CH ARRY SO NO LD | ||
| HMC258LM3TR | LGA/CASON/CH ARRY SO NO LD |
| 製品モデル | 製品ライフサイクル | PCN |
|---|---|---|
|
5 24, 2017 - 17_0100 Change in Moisture Sensitivity Level for LM1 and LM3 Packages |
||
| HMC258LM3 | 製造中止 | |
| HMC258LM3TR | 製造中止 | |
|
12 14, 2015 - 15_0026 Discontinuance of Select Hittite Microwave Products (HMC) from Analog Devices |
||
| HMC258 | 製造中止 | |
| HMC258LC3B | 製造中止 | |
| HMC258LC3BTR | 製造中止 | |
| HMC258LM3 | 製造中止 | |
| HMC258LM3TR | 製造中止 | |
これは最新改訂バージョンのデータシートです。
ツールおよびシミュレーション
評価用キット
HMC258LC3B Evaluation Board
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