ADL8109

• 4-layer, Rogers 4350B and Isola 370HR evaluation board
• End launch, 2.92 mm RF connectors
• Through calibration path (depopulated)

The ADL8109-EVALZ consists of a 4-layer printed circuit board (PCB) fabricated from 0.254 mm (10 mil) thick, Rogers 4350B and Isola 370HR, copper clad, forming a nominal thickness of 1.65 mm (65 mils). The RFIN and RFOUT ports on the ADL8109-EVALZ are populated with 2.92 mm, female coaxial connectors. The ADL8109- EVALZ is populated with components suitable for use over the entire −55°C to +125°C operating temperature range.

To calibrate board trace losses, a through calibration path is provided between the J1 and J2 connectors. J1 and J2 must be populated with RF connectors to use the through calibration path. Refer to Table 1 and Figure 4 for the through calibration path performance.

Access the ADL8109-EVALZ ground path and the VDD pin through the surface-mount technology (SMT) test point connectors, GND and VDD. A supplementary test point for VRBIAS is included for simple access on the RBIAS pin (see Figure 5 for the test point locations).

The RF traces on the ADL8109-EVALZ are 50 Ω, grounded, coplanar waveguide. The package ground leads and the exposed pad connect directly to the ground plane. Multiple vias connect the top and bottom ground planes with particular focus on the area directly beneath the ground paddle to provide adequate electrical conduction and thermal conduction to the heat sink.

The power supply decoupling capacitors on the ADL8109-EVALZ represent the configuration used to characterize and qualify the device.

For full details on the ADL8109, see the ADL8109 data sheet, which must be consulted in conjunction with this user guide when using the ADL8109-EVALZ.