ADPA7006

推荐新设计使用

18 GHz 至 44 GHz GaAs pHEMT MMIC 1/2 W 功率放大器

数据手册 (Rev. A) 产品选型表
产品模型
4
产品技术资料帮助

ADI公司所提供的资料均视为准确、可靠。但本公司不为用户在应用过程中侵犯任何专利权或第三方权利承担任何责任。技术指标的修改不再另行通知。本公司既没有含蓄的允许，也不允许借用ADI公司的专利或专利权的名义。本文出现的商标和注册商标所有权分别属于相应的公司。
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产品详情

  • 输出 P1dB：29 dBm
  • PSAT：29.5 dBm
  • 增益：23.5 dB
  • 输出 IP3：38 dBm
  • 电源电压：5 V (800 mA)
  • 集成功率检测器
  • 50 Ω 匹配输入/输出
  • 裸片尺寸：2.750 mm × 1.805 mm × 0.102 mm
ADPA7006
18 GHz 至 44 GHz GaAs pHEMT MMIC 1/2 W 功率放大器
ADPA7006CHIP Functional Block Diagram ADPA7006CHIP Pin Configuration
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将产品添加到myAnalog 的现有项目或新项目中（接收通知）。

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参考资料

数据手册 2

用户手册 1

应用笔记 3

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添加至 myAnalog

将产品添加到myAnalog 的现有项目或新项目中（接收通知）。

创建新项目

工具及仿真模型

S-参数 2

评估套件

eval board
schematic 1
schematic 2
schematic 3
EVAL-ADPA7006

ADPA7006 Evaluation Board

立即购买 更多内容

特性和优点

  • Fully featured evaluation board for the ADPA7006
  • 2-layer Rogers 4350B evaluation board with heat sink
  • End launch 2.9 mm RF connectors
  • Through calibration path

产品详情

The ADPA7006-EVALZ evaluation board consists of a 2-layer printed circuit board (PCB) fabricated from a 10 mil thick, Rogers 4350B, copper clad mounted to an aluminum heat sink. The heat sink provides thermal relief to the device as well as mechanical support to the PCB. Mounting holes on the heat sink allow attachment to larger heat sinks for improved thermal management.

The RFIN and RFOUT ports on the ADPA7006-EVALZ are populated by 2.9 mm, female coaxial connectors. The respective RF traces of the ports have a 50 Ω characteristic impedance. The ADPA7006-EVALZ is populated with components suitable for use over the entire −40°C to +85°C operating temperature range of the device. To calibrate evaluation board trace losses, a through calibration path is provided between the J3 and J4 connectors. J3 and J4 must be populated with RF connectors to use the through calibration path. See Table 1 and Figure 3 for the through calibration path performance.

The power, ground, gate control voltages, and detector output voltages are accessed through two 8-pin headers (see Table 1).

RF traces are 50 Ω grounded, coplanar waveguide. Package ground leads and the exposed paddle connect directly to the ground plane. Multiple vias connect the top and bottom ground planes with particular focus on the area directly beneath the ground paddle to provide adequate electrical conduction and thermal conduction to the heat sink.

The power supply decoupling capacitors on the ADPA7006-EVALZ represent the configuration used to characterize and qualify the device. It is possible to reduce the number of capacitors with a scope, but the scope varies from system to system. It is recommended to first remove or combine the largest capacitors that are farthest from the device.

For more information about the ADPA7006, refer to the ADPA7006 data sheet. Consult the data sheet in conjunction with this user guide when using the ADPA7006-EVALZ evaluation board.
EVAL-ADPA7006
ADPA7006 Evaluation Board
ADPA7006 Evaluation Board ADPA7006 Evaluation Board ADPA7006 Evaluation Board

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