LTC4303
量产具阻塞总线恢复功能的可热插拔型二线式总线缓冲器
- 产品模型
- 8
产品详情
- Automatic Disconnect of SDA/SCL Lines when Bus is Stuck Low for ≥ 30ms
- Recovers Stuck Busses with Automatic Clocking*
- Bidirectional Buffer* for SDA and SCL Lines Increases Fanout
- Prevents SDA and SCL Corruption During Live Board Insertion and Removal from Backplane
- Pin Compatible with LTC4300A-1
- ±15kV Human Body Model ESD Protection
- Isolates Input SDA and SCL Lines from Output
- Compatible with I2CTM, I2C Fast-Mode and SMBus Standards (Up to 400kHz Operation)
- READY Open Drain Output
- 1V Precharge on All SDA and SCL Lines
- High Impedance SDA, SCL Pins for VCC = 0V
- ENABLE Gates Connection from Input to Output
- MSOP 8-Pin and DFN (3mm × 3mm) Packages
The LTC®4303 hot swappable 2-wire Bus Buffer allows I/O card insertion into a live backplane without corruption of the data and clock busses. When a connection is made, the LTC4303 provides bidirectional buffering, keeping the backplane and card capacitances isolated. If SDAOUT or SCLOUT is low for ≥ 30ms (typ), the LTC4303 automatically breaks the data and clock bus connection. At this time the LTC4303 automatically generates up to 16 clock pulses on SCLOUT in an attempt to free the bus. A connection will be enabled automatically when the bus becomes free.
Rise-time accelerator circuitry allows the use of larger pull-up resistors while still meeting rise-time requirements. During insertion, the SDA and SCL lines are precharged to 1V to minimize bus disturbances. When driven high, ENABLE allows the LTC4303 to connect after a stop bit or bus idle occurs. Driving ENABLE low breaks the connection between SDAIN and SDAOUT, SCLIN and SCLOUT. READY is an open drain output that indicates when the backplane and card sides are connected together.
*Patent Pending
Applications
- Hot Board Insertion
- Servers
- Capacitance Buffer/Bus Extender
- RAID Systems
参考资料
数据手册 1
可靠性数据 1
技术文章 1
视频 3
产品选型卡 2
新闻 1
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| 产品型号 | 引脚/封装图-中文版 | 文档 | CAD 符号，脚注和 3D模型 |
|---|---|---|---|
| LTC4303CDD#PBF | 8-Lead DFN (3mm x 3mm x 0.75mm w/ EP) | ||
| LTC4303CDD#TRPBF | 8-Lead DFN (3mm x 3mm x 0.75mm w/ EP) | ||
| LTC4303CMS8#PBF | 8-Lead MSOP | ||
| LTC4303CMS8#TRPBF | 8-Lead MSOP | ||
| LTC4303IDD#PBF | 8-Lead DFN (3mm x 3mm x 0.75mm w/ EP) | ||
| LTC4303IDD#TRPBF | 8-Lead DFN (3mm x 3mm x 0.75mm w/ EP) | ||
| LTC4303IMS8#PBF | 8-Lead MSOP | ||
| LTC4303IMS8#TRPBF | 8-Lead MSOP |
| 产品型号 | 产品生命周期 | PCN |
|---|---|---|
|
2月 3, 2020 - 20_0128 Laser Top Mark for 8 Lead MSOP Packages Assembled in ADPG and UTAC |
||
| LTC4303CMS8#PBF | 量产 | |
| LTC4303CMS8#TRPBF | 量产 | |
| LTC4303IMS8#PBF | 量产 | |
| LTC4303IMS8#TRPBF | 量产 | |
这是最新版本的数据手册
硬件生态系统
工具及仿真模型
IBIS 模型 1
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