ADAR3003
発売前27 to 31 GHz, 1-Beam & 4-Element, Dual Polarized, Transmit Ka Band Beamformer
- 製品モデル
- 2
- 1Ku当たりの価格
- 価格は未定
製品の詳細
- 27 GHz to 31 GHz frequency range
- Programmable Amplifier bias
- Power Consumption (quiescent)
- Minimum Bias: 570 mW
- Nominal Bias: 700 mW
- 0 to 360 phase adjustment range
- 5.625 phase step size/resolution
- ≥31 dB gain adjustment range
- ≤0.5 dB gain resolution
- Memory for 128 prestored beamstates
- 64 Beamstates per Polarization
- User programmable Sequencer for Beamstate selection
- FIFO Memory for 32 beamstates
- 16 Beamstates per Polarization
- Variable SPI length for flexible & efficient Beam Commands
- Update, Reset, & Mute from 1 up to 16 beams
- 3-wire or 4-wire SPI interface
- Package: 5 mm × 5mm WLCSP
The ADAR3003 is a 27 to 31 GHz single beam, 4 element dual polarized transmit beamforming IC for phased array antennas. Each of the 4 elements have horizontal and vertical polarization. There are 8 RF channels that provide a ≥31 dB gain adjustment range and 360 degrees of phase adjustment range, with resolution of less than ≤0.5 dB and 5.625 degrees, respectively, via Variable Amplitude and Phase (VAP) blocks. Each VAP contains a Digital Stepped Attenuator (DSA) and Phase Shifter. Each channel has an integrated RF power detector at its output, with a 30 dB range.
Access of all the on-chip control registers and memory is through a simple 3-wire or 4-wire serial port interface (SPI). In addition, four address pins allow SPI control of up to 16 devices on the same serial lines. Four VAPs’ worth of data is a single beamstate. The random access memory (RAM) has storage for up to 128 beamstates, organized into 64 beamstates per polarization. The on-chip sequencer selects and advances the beamstate being sourced from either the RAM or the FIFO.
The ADAR3003 is available in a 136-ball 5 m × 5 mm Wafer Level Chip Scale Package (WLCSP) and is specified from −40°C to +85°C.
APPLICATIONS
- Air Terminals
- Ground Terminals
- Maritime Terminals
ドキュメント
ビデオ 2
製品モデル | ピン/パッケージ図 | 資料 | CADシンボル、フットプリント、および3Dモデル |
---|---|---|---|
ADAR3003ACBZ | CHIPS W/SOLDER BUMPS/WLCSP | ||
ADAR3003ACBZ-R7 | CHIPS W/SOLDER BUMPS/WLCSP |