HMC363-Die

PRODUCTION

InGaP HBT Divide-by-8 Chip, DC - 12 GHz

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Part Details

  • Ultra Low SSB Phase Noise: -153 dBc/Hz
  • Wide Bandwidth
  • Output Power: -6 dBm
  • Single DC Supply: +5V
  • Small Size: 1.45 × 0.69 x 0.1 mm
HMC363-Die
InGaP HBT Divide-by-8 Chip, DC - 12 GHz
HMC363 Functional Block Diagram
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Data Sheet

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