OP07S

量产

航空航天用超低失调电压运算放大器

数据手册产品选型表

产品模型: 11

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产品详情

低 V_OS： 75 µV （最大值）
低 V_OS漂移：1.3 µV/°C （最大值）
超稳定的时间漂移性能：1.5 µV/月（最大值）

低噪声：0.6 µV p-p（最大值）
宽输入电压范围：±14 V
宽电源电压范围：3 V至18 V

参考资料

数据手册 3

OP07S: Military Data Sheets 03/17/2021

OP07S: Military JM38510/ (JAN) Specification 03/17/2021

OP07S: Die Data Sheet 03/17/2021

交叉参考指南 1

JAN to Generic Cross Reference 01/22/2009

ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。

产品型号	引脚/封装图-中文版	文档	CAD 符号，脚注和 3D模型
5962R9863901VGA	8 ld Header	Material Declaration Reliablity Data	Ultra Librarian SamacSys
5962R9863901VHA	10-Lead FlatPack	Material Declaration Reliablity Data	Ultra Librarian SamacSys
5962R9863901VPA	8-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
JM38510/13501BGA	ROUND HEADER/METAL CAN	Material Declaration Reliablity Data	Ultra Librarian SamacSys
JM38510/13501BPA	8-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
JM38510/13501SGA	ROUND HEADER/METAL CAN	Material Declaration Reliablity Data	Ultra Librarian SamacSys
JM38510/13501SPA	CERDIP GLASS SEAL	Material Declaration Reliablity Data	Ultra Librarian SamacSys
JM38510/13502BGA	ROUND HEADER/METAL CAN	Material Declaration Reliablity Data	Ultra Librarian SamacSys
JM38510/13502SPA	CERDIP GLASS SEAL	Material Declaration Reliablity Data	Ultra Librarian SamacSys
OP070000C	CHIPS OR DIE	Material Declaration Reliablity Data	Ultra Librarian SamacSys
OP07R000C	CHIPS OR DIE	Material Declaration Reliablity Data	Ultra Librarian SamacSys

产品型号	产品生命周期	PCN

9月 29, 2022 - 22_0195 Shipment Carrier Change for TO-99 Header Package
		PCN22_0195_Form Material_Report Qualification Results Summary
5962R9863901VGA
10月 18, 2019 - 19_0226 OP07 Output Voltage Swing Datasheet Clarification for Aerospace and JANB Models.
		PCN19_0226_Form Material_Report
5962R9863901VGA
5962R9863901VHA
5962R9863901VPA
JM38510/13501BGA	量产
JM38510/13501BPA	量产
JM38510/13502BGA	量产
7月 30, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
		PCN16_0026_Form Material_Report Qualification Results Summary
5962R9863901VGA
5962R9863901VHA
5962R9863901VPA
JM38510/13501SGA	过期
JM38510/13501SPA	过期
JM38510/13502SPA	过期
OP070000C
OP07R000C
10月 29, 2017 - 17_0079 Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing
		PCN17_0079_Form Material_Report Test Correlation Report
5962R9863901VGA
5962R9863901VHA
JM38510/13501SGA	过期
11月 18, 2015 - 15_0219 Laser Marking Standardization for Aerospace Packages
		PCN15_0219_Form Material_Report Qualification Results Summary
5962R9863901VGA
5962R9863901VHA
5962R9863901VPA
JM38510/13501BGA	量产
JM38510/13501BPA	量产
JM38510/13501SGA	过期
JM38510/13501SPA	过期
JM38510/13502BGA	量产
JM38510/13502SPA	过期
OP070000C
OP07R000C
10月 2, 2013 - 13_0163 Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices
		PCN13_0163_Form Material_Report Qualification Plan Summary
5962R9863901VGA
5962R9863901VHA
5962R9863901VPA
JM38510/13501SGA	过期
JM38510/13501SPA	过期
JM38510/13502SPA	过期
11月 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
		PCN11_0050_Form Material_Report
5962R9863901VGA
5962R9863901VHA
5962R9863901VPA
JM38510/13501BGA	量产
JM38510/13501BPA	量产
JM38510/13501SGA	过期
JM38510/13501SPA	过期
JM38510/13502BGA	量产
JM38510/13502SPA	过期
11月 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
		PCN11_0182_Form Material_Report
5962R9863901VGA
5962R9863901VHA
5962R9863901VPA
JM38510/13501BGA	量产
JM38510/13501BPA	量产
JM38510/13501SGA	过期
JM38510/13501SPA	过期
JM38510/13502BGA	量产
JM38510/13502SPA	过期
11月 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
		PCN12_0199_Form Material_Report Qualification Report Summary Datasheet Specification Comparison
5962R9863901VHA
5962R9863901VPA
JM38510/13501BPA	量产
JM38510/13501SPA	过期
JM38510/13502SPA	过期
9月 21, 2009 - 09_0188 Change of Bottom Brand from Ink to Laser for Aerospace Cerpak Packages
		09_0188supportingInfo Material_Report PCN09_0188_Form
5962R9863901VHA		09_0188supportingInfo Material_Report PCN09_0188_Form
2月 9, 2009 - 08_0073 Change of Seal Glass Material for Cerdip & Cerpak Packages
		08_0073AQualPlan Material_Report PCN08_0073_Form
5962R9863901VHA
5962R9863901VPA
4月 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
		PCN16_0026_Form Material_Report Qualification Results Summary
JM38510/13501BGA	量产
JM38510/13501BPA	量产
JM38510/13502BGA	量产
6月 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite
		PCN12_0066_Form Material_Report Qualification Report Summary
JM38510/13501BGA	量产
JM38510/13501BPA	量产
JM38510/13502BGA	量产
6月 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages
		PCN11_0088_Form Material_Report Marking Comparison
JM38510/13501BGA	量产
JM38510/13501SGA	过期
JM38510/13502BGA	量产
2月 1, 2010 - 09_0196 Change In Location of Q Compliance Indicator Location for JAN/38510 Product
		Material_Report PCN09_0196_Form QMarkSupportingInfo
JM38510/13501BGA	量产
JM38510/13501BPA	量产
JM38510/13501SGA	过期
JM38510/13502BGA	量产
7月 31, 2009 - 09_0106 Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products
		09_0106Supporting Material_Report PCN09_0106_Form
JM38510/13501BGA	量产
JM38510/13501BPA	量产
JM38510/13502BGA	量产
6月 11, 2018 - 18_0043 Select Aerospace Product Obsolescence
		PDN18_0043_Form Material_Report
JM38510/13501SGA	过期
JM38510/13501SPA	过期
JM38510/13502SPA	过期

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