Switches and Attenuators for mmWave 5G Evolution
Merve Yilmaz Serdaroglu, applications engineer, introduces the newest family of ultrawideband SOI switches and attenuators supporting 5GmmW applications to 60GHz. Multiple options available in LGA package or bondable die on carrier package
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    Switches and Attenuators for mmWave 5G Evolution

    2022年09月02日

    In this video, Merve Yilmaz Serdaroglu, product applications engineer, from Analog Devices introduces the newest family of ultrawideband SOI switches and digital step attenuators supporting applications to 60GHz. These parts are optimal for the emerging mmW 5G applications as well as other wideband applications. The ADRF5032 (SPDT switch) and ADRF5054 (SP4T switch) are available in surface mount LGA packages, ideal for surface mount assemblies. The ADRF5424 (SPDT switch) and ADRF5474 (30dB digital attenuator) are available in bondable die on carrier package, ideal for chip and wire applications. These parts are designed on silicon-on-insulator process and benefit from all the advantages of this process.

    Switches and Attenuators for mmWave 5G Evolution
    Merve Yilmaz Serdaroglu, applications engineer, introduces the newest family of ultrawideband SOI switches and attenuators supporting 5GmmW applications to 60GHz. Multiple options available in LGA package or bondable die on carrier package
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      Switches and Attenuators for mmWave 5G Evolution

      2022年09月02日
      In this video, Merve Yilmaz Serdaroglu, product applications engineer, from Analog Devices introduces the newest family of ultrawideband SOI switches and digital step attenuators supporting applications to 60GHz. These parts are optimal for the emerging mmW 5G applications as well as other wideband applications. The ADRF5032 (SPDT switch) and ADRF5054 (SP4T switch) are available in surface mount LGA packages, ideal for surface mount assemblies. The ADRF5424 (SPDT switch) and ADRF5474 (30dB digital attenuator) are available in bondable die on carrier package, ideal for chip and wire applications. These parts are designed on silicon-on-insulator process and benefit from all the advantages of this process.

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