OP07S
OP07S
製造中Aerospace Ultra Low Offset Voltage Op Amp
- 製品モデル
- 11
- 1Ku当たりの価格
- 最低価格:$28.36
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製品の詳細
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The OP07 has very low input offset voltage that is obtained by trimming at the wafer stage. These low offset voltages generally eliminate any need for external nulling. The OP07 also features low input bias current and high open-loop gain. The low offsets and high open-loop gain make the OP07 particularly useful for high gain instrumentation applications.
The wide input voltage range of ±13 V minimum combined with a high CMRR and high input impedance provide high accuracy in the noninverting circuit configuration. Excellent linearity and gain accuracy can be maintained even at high closed-loop gains. Stability of offsets and gain with time or variations in temperature is excellent. The accuracy and stability of the OP07, even at high gain, combined with the freedom from external nulling have made the OP07 an industry standard for instrumentation applications.
ドキュメント
データシート 3
クロスリファレンス・ガイド 1
よく聞かれる質問 1
高レベル放射線レポート 1
放射線レポート 1
製品モデル | ピン/パッケージ図 | 資料 | CADシンボル、フットプリント、および3Dモデル |
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5962R9863901VGA | 8 ld Header | ||
5962R9863901VHA | 10-Lead FlatPack | ||
5962R9863901VPA | 8-Lead CerDIP | ||
JM38510/13501BGA | ROUND HEADER/METAL CAN | ||
JM38510/13501BPA | 8-Lead CerDIP | ||
JM38510/13501SGA | ROUND HEADER/METAL CAN | ||
JM38510/13501SPA | CERDIP GLASS SEAL | ||
JM38510/13502BGA | ROUND HEADER/METAL CAN | ||
JM38510/13502SPA | CERDIP GLASS SEAL | ||
OP070000C | CHIPS OR DIE | ||
OP07R000C | CHIPS OR DIE |
製品モデル | 製品ライフサイクル | PCN |
---|---|---|
9 29, 2022 - 22_0195 Shipment Carrier Change for TO-99 Header Package |
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5962R9863901VGA | ||
10 18, 2019 - 19_0226 OP07 Output Voltage Swing Datasheet Clarification for Aerospace and JANB Models. |
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5962R9863901VGA | ||
5962R9863901VHA | ||
5962R9863901VPA | ||
JM38510/13501BGA | 製造中 | |
JM38510/13501BPA | 製造中 | |
JM38510/13502BGA | 製造中 | |
7 30, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
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5962R9863901VGA | ||
5962R9863901VHA | ||
5962R9863901VPA | ||
JM38510/13501SGA | 製造中止 | |
JM38510/13501SPA | 製造中止 | |
JM38510/13502SPA | 製造中止 | |
OP070000C | ||
OP07R000C | ||
10 29, 2017 - 17_0079 Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing |
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5962R9863901VGA | ||
5962R9863901VHA | ||
JM38510/13501SGA | 製造中止 | |
11 18, 2015 - 15_0219 Laser Marking Standardization for Aerospace Packages |
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5962R9863901VGA | ||
5962R9863901VHA | ||
5962R9863901VPA | ||
JM38510/13501BGA | 製造中 | |
JM38510/13501BPA | 製造中 | |
JM38510/13501SGA | 製造中止 | |
JM38510/13501SPA | 製造中止 | |
JM38510/13502BGA | 製造中 | |
JM38510/13502SPA | 製造中止 | |
OP070000C | ||
OP07R000C | ||
10 2, 2013 - 13_0163 Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices |
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5962R9863901VGA | ||
5962R9863901VHA | ||
5962R9863901VPA | ||
JM38510/13501SGA | 製造中止 | |
JM38510/13501SPA | 製造中止 | |
JM38510/13502SPA | 製造中止 | |
11 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
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5962R9863901VGA | ||
5962R9863901VHA | ||
5962R9863901VPA | ||
JM38510/13501BGA | 製造中 | |
JM38510/13501BPA | 製造中 | |
JM38510/13501SGA | 製造中止 | |
JM38510/13501SPA | 製造中止 | |
JM38510/13502BGA | 製造中 | |
JM38510/13502SPA | 製造中止 | |
11 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
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5962R9863901VGA | ||
5962R9863901VHA | ||
5962R9863901VPA | ||
JM38510/13501BGA | 製造中 | |
JM38510/13501BPA | 製造中 | |
JM38510/13501SGA | 製造中止 | |
JM38510/13501SPA | 製造中止 | |
JM38510/13502BGA | 製造中 | |
JM38510/13502SPA | 製造中止 | |
11 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
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5962R9863901VHA | ||
5962R9863901VPA | ||
JM38510/13501BPA | 製造中 | |
JM38510/13501SPA | 製造中止 | |
JM38510/13502SPA | 製造中止 | |
9 21, 2009 - 09_0188 Change of Bottom Brand from Ink to Laser for Aerospace Cerpak Packages |
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5962R9863901VHA | ||
2 9, 2009 - 08_0073 Change of Seal Glass Material for Cerdip & Cerpak Packages |
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5962R9863901VHA | ||
5962R9863901VPA | ||
4 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
||
JM38510/13501BGA | 製造中 | |
JM38510/13501BPA | 製造中 | |
JM38510/13502BGA | 製造中 | |
6 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite |
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JM38510/13501BGA | 製造中 | |
JM38510/13501BPA | 製造中 | |
JM38510/13502BGA | 製造中 | |
6 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages |
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JM38510/13501BGA | 製造中 | |
JM38510/13501SGA | 製造中止 | |
JM38510/13502BGA | 製造中 | |
2 1, 2010 - 09_0196 Change In Location of Q Compliance Indicator Location for JAN/38510 Product |
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JM38510/13501BGA | 製造中 | |
JM38510/13501BPA | 製造中 | |
JM38510/13501SGA | 製造中止 | |
JM38510/13502BGA | 製造中 | |
7 31, 2009 - 09_0106 Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products |
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JM38510/13501BGA | 製造中 | |
JM38510/13501BPA | 製造中 | |
JM38510/13502BGA | 製造中 | |
6 11, 2018 - 18_0043 Select Aerospace Product Obsolescence |
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JM38510/13501SGA | 製造中止 | |
JM38510/13501SPA | 製造中止 | |
JM38510/13502SPA | 製造中止 |
これは最新改訂バージョンのデータシートです。
ツールおよびシミュレーション
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