MAX20327
RECOMMENDED FOR NEW DESIGNS12V Capable, Low-RON, Beyond-the-Rails DPDT Analog Switches
Compact DPDT Can Switch -5.5V to 12V Signals with a Single VCC as Low as 1.6V
- Part Models
- 2
- 1ku List Price
- Starting From $1.31
Part Details
- Distortion-Free Beyond-the-Rails Signaling
- Negative Voltage Audio and Video Signal Capable
- -5.5V to +12V Analog Signal Range Independent of VCC
- On-Resistance 0.2Ω (Typ)
- +1.6V to +5.5V Single-Supply Range
- Total Harmonic Distortion Plus Noise 0.001% (Typ)
- On-Resistance Flatness 0.001Ω (Typ)
- Low Supply Current 30μA (Typ) at 1.6V
- Can be Powered by GPIO
- High-Impedance Mode When VCC Not Applied
- ESD Protection on COM_
- ±15kV Human Body Model
- ±8kV IEC 61000-4-2 Air Gap
- ±6kV IEC 61000-4-2 Contact
- Design Flexibility
- Break-Before-Make Operation
- 9-Bump WLP (1.6mm x 1.6mm)
- −40°C to +85°C Operating Temperature Range
The MAX20327 ultra-small, low-on-resistance (RON) double-pole/double-throw (DPDT) analog switches feature Beyond-the-Rails™ capability that allows signals from -5.5V to +12V to pass without distortion, even when the power supply is below the signal range. The low on-resistance (0.2Ω) also makes the devices ideal for low-distortion switching applications, such as audio or video.
The MAX20327 is fully specified to operate from a single +1.6V to +5.5V power supply. Because of the low supply current requirement, VCC can be provided by a GPIO. When power is not applied, the switches go to a high-impedance mode and all analog signal ports can withstand signals from -5.5V to +5.5V. The switches are controlled with a single control bit, CB.
The MAX20327 is available in a 1.6mm x 1.6mm, 0.4mm pitch, 9-bump wafer-level package (WLP) and operates over the -40°C to +85°C extended temperature range.
Applications
- Cell Phones
- Portable Audio/Video Equipment
- Portable Navigation Devices
- Tablets
Documentation
Data Sheet 1
Video 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| MAX20327EWL+ | Wafer-Level Package 3x3 Bump, Full Array | ||
| MAX20327EWL+T | Wafer-Level Package 3x3 Bump, Full Array |
This is the most up-to-date revision of the Data Sheet.
Tools & Simulations
IBIS Model 1
Evaluation Kits
Evaluation Kit for the MAX20327
Resources
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