HMC8073

RECOMMENDED FOR NEW DESIGNS

0.6 GHz to 3.0 GHz, 0.5 dB LSB, 6-Bit, Silicon Digital Step Attenuator

Part Models
2
1ku List Price
price unavailable
Viewing:

Part Details

  • Attenuation range: 0.5 dB LSB steps to 31.5 dB
  • Low insertion loss 
    • 1.1 dB to 1.0 GHz
    • 1.5 dB to 2.0 GHz
  • Tight attenuation accuracy
    • Less than ±0.25 dB (plus 3% of attenuation state)
  • Low phase shift error: 4° phase shift to 1.0 GHz
  • Bidirectional use: 30 dBm high power handling 
  • Internal dc block on the RFIN/RFOUT pins 
  • High linearity 
    • P1dB: 31 dBm typical 
    • Input IP3: 52 dBm typical
  • Safe state transitions
  • Serial interface with TTL/CMOS
    • Up to 8 devices on a single data bus
  • Single-supply operation: 3.3 V to 5.0 V  
  • ESD sensitivity rating: Class 1C (1 kV human body model) 
  • 16-lead, 3 mm × 3 mm LFCSP package: 9 mm2
HMC8073
0.6 GHz to 3.0 GHz, 0.5 dB LSB, 6-Bit, Silicon Digital Step Attenuator
HMC8073 Functional Block Diagram HMC8073 Pin Configuration
Add to myAnalog

Add product to the Products section of myAnalog (to receive notifications), to an existing project or to a new project.

Create New Project
Ask a Question

Documentation

Learn More
Add to myAnalog

Add product to the Products section of myAnalog (to receive notifications), to an existing project or to a new project.

Create New Project

Tools & Simulations

S-Parameter 1

IBIS Model 1

ADIsimRF

ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.

Open Tool

Evaluation Kits

eval board
EVAL-HMC8073

HMC8073 Evaluation Board

Product Details

The HMC8073 evaluation board is constructed of a 4 layer material with a copper thickness of 0.7 mil on each layer. Every copper layer is separated with a dielectric material. The top dielectric material is 10 mil RO4350. The middle and bottom dielectric materials are FR-4, used for mechanical strength and overall board thickness of approximately 62 mil, which allows SMA connectors to be slipped in at the board edges.

EVAL-HMC8073
HMC8073 Evaluation Board
HMC8073LP3DE-EVALZANGLE-web HMC8073LP3DE-EVALZBOTTOM-web HMC8073LP3DE-EVALZTOP-web

Latest Discussions

Recently Viewed