ADSP-BF533
量产High Performance General Purpose Blackfin Processor
- 产品模型
- 8
产品详情
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The ADSP-BF533 provides a high performance, power-efficient processor choice for today's most demanding convergent signal processing applications. The high performance 16-bit/32-bit Blackfin® embedded processor core, the flexible cache architecture, the enhanced DMA subsystem, and the dynamic power management (DPM) functionality allow system designers a flexible platform to address a wide range of applications including consumer, communications, automotive, and industrial/instrumentation.
Architectural Features- High performance 16-bit/32-bit embedded processor core
- 10-stage RISC MCU/DSP pipeline with mixed 16-bit/32-bit ISA for optimal code density
- Full SIMD architecture, including instructions for accelerated video and image processing
- Memory management unit (MMU) supporting full memory protection for an isolated and secure environment
- Up to 148 kB of on-chip SRAM
- Glueless video capture and display port
- Two dual-channel, full-duplex, synchronous serial ports supporting eight stereo I2S channels
- 12 DMA channels supporting one- and two-dimensional data transfers
- Memory controller providing glueless connection to multiple banks of external SDRAM, SRAM, Flash, or ROM
- 160-ball mini-BGA, 169-ball PBGA packages
- Industrial temperature ranges (40°C to 85°C) and commercial temperature ranges (0°C to 70°C) available
参考资料
数据手册 1
用户手册 6
应用笔记 59
技术文章 7
处理器手册 3
产品亮点 3
软件手册 11
仿真器使用手册 3
集成电路异常 1
客户案例研究 12
评估工具包手册 10
产品亮点 3
产品选型指南 1
模拟对话 1
ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。
产品型号 | 引脚/封装图-中文版 | 文档 | CAD 符号,脚注和 3D模型 |
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ADSP-BF533SBBCZ-5V | 160-Ball CSPBGA (12mm x 12mm x 1.7mm) | ||
ADSP-BF533SBBCZ400 | 160-Ball CSPBGA (12mm x 12mm x 1.7mm) | ||
ADSP-BF533SBBCZ500 | 160-Ball CSPBGA (12mm x 12mm x 1.7mm) | ||
ADSP-BF533SBBZ400 | 169 Ball BGA | ||
ADSP-BF533SBBZ500 | 169 Ball BGA | ||
ADSP-BF533SBSTZ400 | 176 ld LQFP (24x24mm) | ||
ADSP-BF533SKBCZ-6V | 160-Ball CSPBGA (12mm x 12mm x 1.7mm) | ||
ADSP-BF533SKSTZ-5V | 176 ld LQFP (24x24mm) |
产品型号 | 产品生命周期 | PCN |
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9月 5, 2013 - 13_0188 Datasheet changes for Blackfin ADSP-BF531/ BF532/ BF533 Processors |
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ADSP-BF533SBBCZ-5V | 量产 | |
ADSP-BF533SBBCZ400 | 量产 | |
ADSP-BF533SBBCZ500 | 量产 | |
ADSP-BF533SBBZ400 | 量产 | |
ADSP-BF533SBBZ500 | 量产 | |
ADSP-BF533SBSTZ400 | 量产 | |
ADSP-BF533SKBCZ-6V | 量产 | |
ADSP-BF533SKSTZ-5V | 量产 | |
6月 18, 2010 - 07_0093 Conversion to Laser Mark for all ADSPXXXX, ADSSTXXXX, and PC Audio Codecs Ink on Plastic Encapsulated Parts |
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ADSP-BF533SBBCZ-5V | 量产 | |
ADSP-BF533SBBCZ400 | 量产 | |
ADSP-BF533SBBCZ500 | 量产 | |
ADSP-BF533SBBZ400 | 量产 | |
ADSP-BF533SBBZ500 | 量产 | |
ADSP-BF533SBSTZ400 | 量产 | |
ADSP-BF533SKBCZ-6V | 量产 | |
6月 9, 2010 - 10_0112 Datasheet Update for ADSP-BF531/BF532/BF533 Products |
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ADSP-BF533SBBCZ-5V | 量产 | |
ADSP-BF533SBBCZ500 | 量产 | |
ADSP-BF533SBBZ500 | 量产 | |
ADSP-BF533SKBCZ-6V | 量产 | |
ADSP-BF533SKSTZ-5V | 量产 | |
2月 17, 2010 - 09_0173 Power-Up Reset timing specification change applicable to select Blackfin Processors. |
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ADSP-BF533SBBCZ-5V | 量产 | |
ADSP-BF533SBBCZ400 | 量产 | |
ADSP-BF533SBBCZ500 | 量产 | |
ADSP-BF533SBBZ400 | 量产 | |
ADSP-BF533SBBZ500 | 量产 | |
ADSP-BF533SBSTZ400 | 量产 | |
ADSP-BF533SKBCZ-6V | 量产 | |
ADSP-BF533SKSTZ-5V | 量产 | |
9月 2, 2009 - 09_0028 Material set change for 12x12mm CSP_BGA package (Affects ADSP-BF531/BF531W, ADSP-BF532/BF532W and ADSP-BF533/BF533W generics) |
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ADSP-BF533SBBCZ-5V | 量产 | |
ADSP-BF533SBBCZ500 | 量产 | |
ADSP-BF533SKBCZ-6V | 量产 | |
8月 26, 2020 - 20_0133 Assembly Transfer of Select PBGA Products and Conversion to CSP_BGA to STATS ChipPAC Korea |
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ADSP-BF533SBBZ400 | 量产 | |
ADSP-BF533SBBZ500 | 量产 | |
10月 18, 2016 - 16_0034 Assembly Relocation of Select LQFP,LQFP_EP,MQFP,TQFP,TQFP_EP Products to Stats ChipPAC China Jiangyin |
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ADSP-BF533SBSTZ400 | 量产 | |
ADSP-BF533SKSTZ-5V | 量产 |
这是最新版本的数据手册
软件资源
软件模块 2
软件工具异常 1
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更多内容Evaluation Software 0
工具及仿真模型
IBIS 模型 4
- ADSP-BF531/BF532/BF533 2.5/3.3V I/O Blackfin Processor IBIS Datafile 160-Ball CSP BGA Package (09/2005)
- ADSP-BF531/BF532/BF533 Blackfin Processor IBIS Datafile 176-Pin LQFP Package (03/2006)
- ADSP-BF531/BF532/BF533 Blackfin Processor IBIS Datafile PBGA Package (05/2008)
- ADSP-BF531/BF532/BF533 1.8 V I/O Blackfin Processor IBIS Datafile 160-Ball CSP BGA Package (08/2008)
Blackfin Processors Software and Tools
打开工具
BSDL 模型文件 3
Designing with BGA
Surface Mount Assembly Recommendations for Plastic Ball Grid Array (PBGA) Packages
打开工具Blackfin Software Development Kit (SDK) Downloads
The Blackfin® SDK contains free applications software with source code and utilities information and tools that allow you to develop Blackfin processor based applications.
打开工具评估套件
最新评论
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