AD7847

量产

完整的LC²MOS、双通道12位MDAC，采用并行加载结构

数据手册 (Rev. C) 产品选型表

产品模型: 8

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产品详情

两个12位MDAC，内置输出放大器
0.3"、24引脚DIP和24引脚SOIC封装，节省空间

四象限乘法
并行加载结构AD7847
(8+4)加载结构：AD7837

参考资料

数据手册 2

AD7837/AD7847: LC²MOS Complete, Dual 12-Bit MDACs Data Sheet (Rev.C) 01/26/1990

AD7847: Military Data Sheet 01/01/2000

ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。

产品型号	引脚/封装图-中文版	文档	CAD 符号，脚注和 3D模型
5962-9451802MLA	24-Lead CerDIP (Narrow 0.3 Inch)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7847ANZ	24-Lead PDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7847AQ	24-Lead CerDIP (Narrow 0.3 Inch)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7847ARZ	24-Lead SOIC (Wide)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7847ARZ-REEL	24-Lead SOIC (Wide)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7847BNZ	24-Lead PDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7847BRZ	24-Lead SOIC (Wide)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7847BRZ-REEL	24-Lead SOIC (Wide)	Material Declaration Reliablity Data	Ultra Librarian SamacSys

产品型号	产品生命周期	PCN

4月 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
		PCN16_0026_Form Material_Report Qualification Results Summary
5962-9451802MLA
11月 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
		PCN12_0199_Form Material_Report Qualification Report Summary Datasheet Specification Comparison
5962-9451802MLA
AD7847AQ
11月 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
		PCN11_0050_Form Material_Report
5962-9451802MLA
AD7847AQ
11月 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
		PCN11_0182_Form Material_Report
5962-9451802MLA
AD7847AQ
2月 8, 2010 - 04_0080 Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
		PCN04_0080_Form Material_Report Reliability Report Reliability Report
5962-9451802MLA
AD7847ANZ	量产
AD7847AQ
AD7847ARZ	量产
AD7847ARZ-REEL	量产
AD7847BNZ	量产
AD7847BRZ	量产
AD7847BRZ-REEL	量产
2月 1, 2010 - 10_0020 Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility.
		Material_Report PCN10_0020_Form Qual Plan
5962-9451802MLA		Material_Report PCN10_0020_Form Qual Plan
3月 7, 2019 - 19_0046 Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
		PCN19_0046_Form Material_Report Detailed Change Description Qualification Results Summary
AD7847ANZ	量产
AD7847BNZ	量产
8月 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
		Material_Report Material_Report Parts List PCN07_0024_Form Qual Data
AD7847ANZ	量产
AD7847BNZ	量产
2月 7, 2011 - 10_0003 Halogen Free Material Change for SOIC Wide Body Products Assembled at Amkor
		PCN10_0003_Form Material_Report Qualification Plan Summary
AD7847ARZ	量产
AD7847ARZ-REEL	量产
AD7847BRZ	量产
AD7847BRZ-REEL	量产

这是最新版本的数据手册

硬件生态系统

部分模型	产品周期	描述
AD5752R	量产	完整的双通道、16位、串行输入、单极性/双极性、电压输出DAC

工具及仿真模型

精密DAC误差预算工具

精密DAC误差预算工具是一种Web应用程序，用于计算精密DAC信号链的直流精度。它可显示整个信号链中的静态误差状况，以快速评估设计利弊。可计算由基准电压源、运算放大器和精密DAC引起的直流误差。

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