AD7225

不推荐用于新设计

配有独立基准电压输入的LC²MOS四通道8位DAC

数据手册 (Rev. C) 产品选型表

产品模型: 8

Viewing:

产品详情

4个8位DAC、内置输出放大器
每个DAC都有独立的基准电压输入
微处理器兼容型双缓冲输入
所有4路输出同步更新

单电源或双电源供电
可在扩展温度范围内工作
无需用户调整
24引脚超小型DIP、SOIC和28引脚表贴封装

参考资料

数据手册 1

AD7225: LC²MOS Quad 8-Bit DAC with Separate Reference Inputs Data Sheet (Rev.C) 03/23/2010

ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。

产品型号	引脚/封装图-中文版	文档	CAD 符号，脚注和 3D模型
AD7225BQ	24-Lead CerDIP (Narrow 0.3 Inch)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7225KNZ	24-Lead PDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7225KRZ	24-Lead SOIC (Wide)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7225LNZ	24-Lead PDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7225LPZ	28 ld PLCC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7225LPZ-REEL	28 ld PLCC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7225LRZ	24-Lead SOIC (Wide)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7225LRZ-REEL	24-Lead SOIC (Wide)	Material Declaration Reliablity Data	Ultra Librarian SamacSys

产品型号	产品生命周期	PCN

11月 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
		PCN12_0199_Form Material_Report Qualification Report Summary Datasheet Specification Comparison
AD7225BQ
11月 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
		PCN11_0050_Form Material_Report
AD7225BQ		PCN11_0050_Form Material_Report
11月 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
		PCN11_0182_Form Material_Report
AD7225BQ		PCN11_0182_Form Material_Report
2月 8, 2010 - 04_0080 Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
		PCN04_0080_Form Material_Report Reliability Report Reliability Report
AD7225BQ
3月 7, 2019 - 19_0046 Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
		PCN19_0046_Form Material_Report Detailed Change Description Qualification Results Summary
AD7225KNZ	量产
AD7225LNZ	量产
8月 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
		Material_Report Material_Report Parts List PCN07_0024_Form Qual Data
AD7225KNZ	量产
AD7225LNZ	量产
8月 4, 2010 - 10_0117 Halogen Free Material Change for SOIC_W Products at Carsem
		PCN10_0117_Form Material_Report Reliability Report
AD7225KRZ	量产
AD7225LRZ	量产
AD7225LRZ-REEL	量产
7月 21, 2014 - 13_0297 Qualification of ASE Chungli, as an Alternate Assembly Site for Select 16L, 20L, 24L and 28L SOICW Packages
		PCN13_0297_Form Material_Report Detailed Change Description Qualification Results Summary
AD7225LRZ	量产
AD7225LRZ-REEL	量产

这是最新版本的数据手册

硬件生态系统

部分模型	产品周期	描述
AD5304	量产	2.5 V至5.5 V、500 µA、4通道、电压输出8位DAC，采用10引脚封装
AD5307	量产	2.5 V至5.5 V、400 µA、四通道、电压输出8位DAC，采用16引脚TSSOP封装

工具及仿真模型

精密DAC误差预算工具

精密DAC误差预算工具是一种Web应用程序，用于计算精密DAC信号链的直流精度。它可显示整个信号链中的静态误差状况，以快速评估设计利弊。可计算由基准电压源、运算放大器和精密DAC引起的直流误差。

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