ADG759
PRODUCTIONCMOS Low Voltage, 3 ohms 4-Channel Multiplexer
- Part Models
- 3
- 1ku List Price
- Starting From $1.80
Part Details
- 1.8 V to 5.5 V Single Supply
- ±2.5 V Dual Supply
- 3 Ω ON Resistance
- 0.75 Ω ON Resistance Flatness
- 20-Lead 4 mm x 4 mm Chip Scale Package
- For Functionally Equivalent Devices in 16-Lead TSSOP Package, See ADG708/ADG709
- Single 8-to-1 Multiplexer ADG758
- Differential 4-to-1 Multiplexer ADG759
- 14 ns Switching Times
- Low Power Consumption
- TTL-/CMOS-Compatible Inputs
- 100 pA Leakage Currents
The ADG759 is a low voltage, CMOS analog multiplexer comprising four differential channels. The ADG759 switches one of four differential inputs to a common differential output as determined by the 2-bit binary address lines A0 and A1. An EN input is used to enable or disable the device. When disabled, all channels are switched OFF.
Low power consumption and operating supply range of 1.8 V to 5.5 V make the ADG759 ideal for battery-powered, portable instruments. All channels exhibit break-before-make switching action preventing momentary shorting when switching channels.
The ADG759 is available in a 16-lead TSSOP package.
APPLICATIONS
- Data Acquisition Systems
- Communication Systems
- Relay Replacement
- Audio and Video Switching
- Battery-Powered Systems
PRODUCT HIGHLIGHTS
- Small 20-Lead 4 mm × 4 mm Chip Scale Packages (CSP).
- Single/Dual Supply Operation. The ADG758 and ADG759 are fully specified and guaranteed with 3 V and 5 V single-supply and ±2.5 V dual-supply rails.
- Low RON (3 Ω Typical).
- Low Power Consumption (<0.01 µW).
- Guaranteed Break-Before-Make Switching Action.
Documentation
Data Sheet 1
Technical Articles 3
Product Selection Guide 1
Circuit Note 1
Analog Dialogue 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
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ADG759BCPZ | 20-Lead LFCSP (4mm x 4mm w/ EP) | ||
ADG759BCPZ-REEL | 20-Lead LFCSP (4mm x 4mm w/ EP) | ||
ADG759BCPZ-REEL7 | 20-Lead LFCSP (4mm x 4mm w/ EP) |
Part Models | Product Lifecycle | PCN |
---|---|---|
Mar 23, 2012 - 11_0104 Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to ASE-Korea. |
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ADG759BCPZ | PRODUCTION | |
ADG759BCPZ-REEL | PRODUCTION | |
ADG759BCPZ-REEL7 | PRODUCTION | |
Feb 8, 2010 - 04_0080 Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland. |
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ADG759BCPZ | PRODUCTION | |
ADG759BCPZ-REEL7 | PRODUCTION | |
Feb 15, 2010 - 07_0061 LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC |
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ADG759BCPZ-REEL | PRODUCTION |
This is the most up-to-date revision of the Data Sheet.