パッケージに関する資料
パッケージに関する資料のページでは、パッケージに関して重要なアプリケーションおよびプロセス情報を提供します。
アプリケーション・ノート
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Hydrogen Effects On Exotic Material Devices (Rev. 1.1) PDF
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AN-1448: PBGA パッケージのリワーク推奨手順 PDF
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Gel-PAK® & Waffle Pack Bare Die (Chip) Packaging Information PDF
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SMT Assembly for Leadless Packages PDF
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Layout Guidelines for MMIC Components PDF
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AN-000: Thermal Characteristics (Rev. 0) PDF
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Application Notes for Thermally Enhanced Leaded Plastic Packages PDF
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AN-001: Tube and Tray Device Counts (Rev. B) PDF
チュートリアル
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MT-101: Decoupling Techniques pdf
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MT-093: Thermal Design Basics pdf
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MT-096: RFI Rectification Concepts pdf
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MT-095: EMI, RFI, and Shielding Concepts pdf
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MT-099: Analog Circuit Simulation PDF
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MT-100: Breadboarding and Prototyping Techniques pdf
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MT-098: Low Voltage Logic Interfacing pdf
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MT-097: Dealing with High Speed Logic pdf
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MT-094: Microstrip and Stripline Design pdf
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MT-092: Electrostatic Discharge (ESD) pdf
技術記事
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Where Is Ground?
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Well Grounded, Digital Is Analog
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Power Supply and Ground Design for a WiFi Transceiver
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Avoid PC-Layout \"Gotchas\" in ISM-RF Products
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Successful PCB Grounding with Mixed-Signal Chips - Follow the Path of Least Impedance
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PCBs Layout Guidelines for RF & Mixed-Signal
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Minimize Noise in Audio Channels with Smart PCB Layout