製品概要
製品概要
The circuit board used in the application should use RF circuit design techniques. signal lines should have 50 Ohm impedance while the package ground leads and exposed ground paddle should be connected directly to the ground plane similar to that shown. A sufficient number of via holes should be used to connect the top and bottom ground planes.
マーケット&テクノロジー
対象となる製品
関連資料
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HMC6380 Design Files2020/12/08ZIP133 K