MAX32666

PRODUCTION

Low-Power ARM Cortex-M4 with FPU-Based Microcontroller with Bluetooth 5 for Wearables

Generation UB MCUs are Built to Run Complex Applications Demanded by Battery-Powered and Wirelessly Connected Devices

Part Models
8
1ku List Price
Starting From $7.48
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Part Details

  • High-Efficiency Microcontroller and Audio DSP for Wearable and Hearable Devices
    • Arm Cortex-M4 with FPU Up to 96MHz
    • Optional Second Arm Cortex-M4 with FPU Optimized for Data Processing
    • Low-Power 7.3728MHz System Clock Option
    • 1MB Flash, Organized into Dual Banks 2 x 512KB
    • 560KB SRAM; 3 x 16KB Cache
  • Bluetooth 5 Low Energy Radio
    • 1Mbps and 2Mbps Data Throughput
    • Long Range (125kbps and 500kbps)
    • Advertising Extension
    • Rx Sensitivity: -95dbm; Tx Power Up to +4.5dbm
    • On-Chip Matching with Single-Ended Antenna Port
  • Power Management Maximizes Operating Time for Battery Applications
    • Integrated SIMO SMPS for Coin-Cell Operation
    • Dynamic Voltage Scaling Minimizes Active Core Power Consumption
    • 27.3µA/MHz at 3.3V Executing from Cache
    • Selectable SRAM Retention in Low Power Modes with RTC Enabled
  • Multiple Peripherals for System Control
    • Three QSPI Master/Slave with Three Chip Selects Each, Three 4-Wire UARTs, Three I2C Master/Slave, Up to 50 GPIOs
    • QSPI (SPIXF) with Real-Time Flash Decryption
    • QSPI (SPIXR) RAM Interface Provides SRAM Expansion
    • 8-Input, 10-Bit Delta-Sigma ADC 7.8ksps
    • USB 2.0 HS Engine with Internal Transceiver
    • PDM Interface Supports Two Digital Microphones
    • I2S with TDM, Six 32-Bit Timers, Two High-Speed Timers, 1-Wire® Master, 16 Pulse Train (PWM) Engines
    • Secure Digital Interface Supports SD3.0/SDIO3.0/eMMC4.51
  • Secure Valuable IP/Data with Hardware Security
    • Trust Protection Unit (TPU) with MAA Supports Fast ECDSA and Modular Arithmetic
    • AES/SHA-2/DES/3DES Hardware Accelerator
    • TRNG Seed Generator
  • Ensure Software Integrity and Loading
    • Secure Bootloader (SCPBL)
    • Secure Boot
MAX32666
Low-Power ARM Cortex-M4 with FPU-Based Microcontroller with Bluetooth 5 for Wearables
MAX32665, MAX32666, MAX32667, MAX32668: Simplified Block Diagram
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Software Resources


Tools & Simulations


Evaluation Kits

eval board
AD-PAARRAY3552R-SL

RF Front-end GaN Power Amplifier Biasing, Protection, and Control Reference Design

Features and Benefits

  • Designed to cover full Tx signal chains with integrated MCU and user-friendly GUI for faster and easier integration
  • Supports fault event protection - overvoltage (OV), overcurrent (OC), and overtemperature (OT)
  • Supports ultrafast sub-µs GaN gate voltage switching ~ (<1 µs)
  • Supports ultrafast (<10 µs) fault event protection from detection up to GaN gate pinch-off
  • Wide range of gate bias voltages from -10 V to +10 V
  • Configurable power-up and power-down sequence

Product Details

The AD-PAARRAY3552R-SL reference design provides control, protection, and proper biasing sequence for GaN power amplifier (PA) arrays. The design incorporates the AD3553R high-speed, dual-channel, 16-bit DAC to support the ultrafast sub-µs voltage settling time of GaN gates.

Key fault events, including overvoltage, overcurrent, and overtemperature, are effectively managed by the LTC7000, a static switch driver responsible for system fault protection.

The on-board MAX32666 ultralow-power ARM® Cortex®-M4 microprocessor provides essential debug and programming features for a comprehensive software development experience with the system. The system's firmware is built on ADI's open-source no-OS framework and includes a user-friendly graphical interface (GUI) for evaluation. Updates are easily applied through an SWD UART bootloader, streamlining prototyping.

The system can be powered by an external +48 V supply, requiring high current capabilities.

APPLICATIONS

  • 5G massive MIMOs
  • Macro base stations
Specifications
Fault Events
Fault Default Limit
Overvoltage +55 V
Overcurrent 3.5 A
Overtemperature 75°C
Output Ports
Port Name No. of ports
GaN gate ports 6
+48 V Gan drain ports 4
+5 V ports 5
Enable ports 2
Power Supply
External +48 V DC at 5 A
Operating Conditions
Temperature Range 45°C to +75°C

eval board
MAX32666EVKIT

Evaluation Kit for the MAX32665/MAX32666/MAX32667/MAX32668

Features and Benefits

  • Bluetooth SMA connector with a 2.4GHz Hinged Whip Antenna
  • 1.28in 128 × 128 Monochrome TFT Display
  • 64MB XIP Flash
  • 1MB XIP RAM
  • Stereo Audio Codec with Line-In and Line-Out 3.5mm Jacks
  • Digital Audio Microphone
  • USB 2.0 Micro B Interface
  • USB 2.0 Micro B to Serial UARTs
    • Selection with Jumpers Between UART1 and UART2
  • Micro SD Card Interface
  • Select GPIOs Accessed Through a 0.1in Header
  • Access to the 8 Analog Inputs Through a 0.1in Header
  • Arm® or SWD JTAG 20-Pin Header
  • 1-Wire RJ11 Port
  • Can Be Solely Sourced by a Coin Cell Battery
  • Board Power Provided by Either USB Port
  • Individual Power Measurement on All IC Rails Through Jumpers
  • On-Board 1.8V and 3.3V Regulators
  • Two General-Purpose LEDs and Two General-Purpose Pushbutton Switches

Product Details

The MAX32666 EV kit provides a platform for evaluat- ing the capabilities of the MAX32665 and MAX32666 high-efficiency Arm® microcontrollers and audio DSP for wearable and hearable device applications.

Applications

  • Connected Home
  • Gaming Devices
  • Hearables
  • Industrial Sensors
  • Payment/Fitness/Medical Wearables
  • Telemedicine

MAX32666FTHR

Evaluation Kit for the MAX32666

Features and Benefits

  • MAX32666 Microcontroller
    • Dual Arm Cortex-M4F, 96MHz
    • 1MB Flash Memory
    • 560KB SRAM
    • 3 x 16KB Cache
    • Bluetooth 5 Low Energy Radio
    • High-Speed USB 2.0
    • Three QSPI Master/Slave
    • Three I2C Master/Slave
    • Three UARTS
    • SD/SDIO 3.0
    • 1-Wire® Master
    • 48 GPIO
    • 8 Input, 10-Bit ADC
  • MAX1555 1-Cell Li+ Battery Charger
    • Charge from USB
    • On-Chip Thermal Limiting
    • Charge Status Indicator
  • Expansion Connections
    • Breadboard Compatible Headers
    • 10-Pin Cortex Debug Header
    • Micro USB Connector
    • Micro SD Card Connector
  • Integrated Peripherals
    • RGB Indicator LED
    • User Pushbutton
    • 6-Axis Accelerometer/Gyro
    • Bluetooth Surface Mount Antenna
  • SWD/MAXDAP Debug Interface
    • Drag-and-Drop Programming
    • SWD Debugger
    • Virtual UART Console

Product Details

The MAX32666FTHR board is a rapid development platform to help engineers quickly implement battery optimized Bluetooth® 5 solutions with the MAX32666 Arm® Cortex®-M4 processor with FPU. The board also includes the MAX1555 1-Cell Li+ battery charger for battery management. The form factor is a small 0.9in by 2.0in dual-row header footprint that is compatible with breadboards and off-the-shelf peripheral expansion boards. The board also includes a variety of peripherals, such as a micro SD card connector, 6-axis accelerometer/gyro, RGB indicator LED, and pushbutton. This platform provides power-optimized flexible for quick proof-of-concepts and early software development to enhance time to market.

Applications

  • Connected Home
  • Gaming Devices
  • Hearables
  • Industrial Sensors
  • Payment/Fitness/Medical Wearables
  • Telemedicine

eval board
Voyager 4

Wireless Asset Health Monitoring with Edge AI

Features and Benefits

The MEMS-based Wireless Vibration Monitoring Platform is a complete evaluation solution that includes:

  • Intelligent, smarter, and secure decisions at the EDGE
  • Decision making at the edge reduces network overhead and improves battery life
  • Mechanical mounting and measurement capability up to 8 kHz bandwidth
  • 3-axis ultra-low power, ultra-low noise MEMS accelerometer technology
  • Ultra-low power microcontroller and robust low power Bluetooth Low Energy (BLE) technology

It enables users to:

  • Develop and deploy artificial intelligence at the EDGE
  • Rapidly deploy a wireless solution to a machine or test setup
  • Evaluate ADI MEMS sensor technology for vibration monitoring
  • Evaluate ADI BLE technology for industrial wireless sensing
  • Accelerate asset monitoring and solution development
  • Evaluate and develop EDGE AI solutions for industrial condition-based monitoring

Product Details

Voyager 4 uses triaxial digital out MEMS sensors including the ADXL382 and ADXL367. The design also includes the MAX32666 BLE and MAX78000 AI microcontrollers. Flexible and PCB area efficient PMIC power devices have been added as load switches for enhanced wireless sensor power savings. A BLE 5.3 Adapter with Antenna is included in every Voyager4 kit. Voyager4 uses BLE which makes it compatible with any PC with a Bluetooth Radio, but to ensure optimal performance and range, using the adapter when communicating with Voyager4 is recommended.

The solution operates in two modes:

Data Collection/Streaming mode – In this mode, the data is sent to the Host PC for AI model development.

Normal Operation/AI mode – In this mode, the anomaly alert is sent to the Host PC and user can decide to gather more ADXL382 data.

AD-PAARRAY3552R-SL
RF Front-end GaN Power Amplifier Biasing, Protection, and Control Reference Design
AD-PAARRAY3552R-SL Block Diagram AD-PAARRAY3552R-SL Board Photo Angle View AD-PAARRAY3552R-SL Board Photo Top View AD-PAARRAY3552R-SL Board Photo Bottom View
MAX32666EVKIT
Evaluation Kit for the MAX32665/MAX32666/MAX32667/MAX32668
MAX32666EVKIT Angle MAX32666EVKIT Top MAX32666EVKIT Bottom
MAX32666FTHR
Evaluation Kit for the MAX32666
Voyager 4
Wireless Asset Health Monitoring with Edge AI
VOYAGER 4 Board Photo Front 1 View VOYAGER 4 Board Photo Angle View Voyager 4 Block Diagram

Reference Designs

Health Sensor Platform 3.0
MAXREFDES104 Circuits from the lab

Health Sensor Platform 3.0

Features and Benefits

Features

  • Photoplethysmography (PPG)
  • Biopotential measurement (ECG)
  • Skin temperature measurement
  • Embedded heart-rate (HRM) and oxygen saturation (SpO2) algorithms
  • Motion and acceleration
  • Wearable form factor

What's in the Box

  • Complete Assembled Wearable
  • BLE USB Dongle (CY5677)
  • USB-A to USB-C cable
  • USB-A to Micro-USB cable
  • Programmer Board (MAXDAP-USB-C)

Part Used


Design & Integration Tools


Videos

  • lazy blur
    VIDEO · 2022-10-04 02:35
    MAXREFDES104: Health Sensor Platform 3.0
MAXREFDES106 Health Sensor Platform 4.0
MAXREFDES106 Circuits from the lab

Health Sensor Platform 4.0

Features and Benefits

Features

  • Photoplethysmography (PPG)
  • Biopotential Measurement (ECG)
  • Bioimpedance Measurement (BioZ)
  • Skin and Ambient Temperature
  • Embedded Heart Rate (HR), Respiration Rate (RR), Oxygen Saturation (SpO2), Impedance Cardiography (ICG), and Body Impedance Analysis (BIA) Algorithms
  • Location Finder to Determine the Optimal Placement Location on the Chest
  • Motion and Acceleration
  • Chest-Worn Form Factor

Application

  • Remote Patient Monitoring/Vital Sign Patch

Part Used


Design & Integration Tools


Videos

  • lazy blur
    VIDEO · 2023-02-08 02:38
    Body Vitals on Wearables: Your Body, Talking to You
  • lazy blur
    VIDEO · 2023-11-30 04:23
    Unboxing MAXREFDES106
  • lazy blur
    VIDEO · 2022-12-13 02:28
    ADI´s Health Sensor Platform 4.0
MAXREFDES178: Artificial Intelligence Applications
MAXREFDES178 Circuits from the lab

Artificial Intelligence Applications

Features and Benefits

  • Two MAX78000 ARM Cortex M4F Microcontrollers with CNN Accelerator
  • BLE5 Wireless Connectivity
  • Li-Ion Battery Powered
  • Color Image Sensor
  • Digital Microphone
  • Multiple audio codecs with stereo audio input and output
  • Color TFT Capacitive Touch LCD
  • Micro SD Connector
  • On-Board QSPI FLASH and QSPI SRAM
MAXREFDES104
Health Sensor Platform 3.0
Health Sensor Platform 3.0
Health Sensor Platform 3.0
Health Sensor Platform 3.0
Heart Rate
MAXREFDES104 Block Diagram
MAXREFDES104
ECG chart
MAXREFDES106
Health Sensor Platform 4.0
MAXREFDES106 Health Sensor Platform 4.0
MAXREFDES106 Health Sensor Platform 4.0
MAXREFDES106 Health Sensor Platform 4.0
MAXREFDES178
Artificial Intelligence Applications
MAXREFDES178: Artificial Intelligence Applications

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