AMP03

PRODUCTION

High-Speed Differential Amplifier

Data Sheet (Rev. F) Product Selection Table

Part Models: 6
1ku List Price: Starting From $3.49

Viewing:

Part Details

High CMRR: 100 dB Typ
Low Nonlinearity: 0.001% Max
Low Distortion: 0.001% Typ
Wide Bandwidth: 3 MHz Typ
Fast Slew Rate: 9.5 V/µs Typ
Fast Settling (0.01%): 1µs Typ
Low Cost

Part Models: 6
1ku List Price: Starting From $3.49

Documentation

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
AMP03-CHIPS-WP	CHIPS OR DIE	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AMP03BJZ	8-Pin TO-99	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AMP03FJZ	8-Pin TO-99	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AMP03GPZ	8-Lead PDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AMP03GSZ	8-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AMP03GSZ-RL	8-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
		PCN11_0050_Form Material_Report
AMP03BJZ	PRODUCTION
AMP03FJZ	PRODUCTION
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
		PCN11_0182_Form Material_Report
AMP03BJZ	PRODUCTION
AMP03FJZ	PRODUCTION
AMP03GPZ	PRODUCTION
AMP03GSZ	PRODUCTION
AMP03GSZ-RL	PRODUCTION
Jun 1, 2011 - 11_0088 Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages
		PCN11_0088_Form Material_Report Marking Comparison
AMP03BJZ	PRODUCTION
AMP03FJZ	PRODUCTION
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
		Material_Report Material_Report Parts List PCN07_0024_Form Qual Data
AMP03GPZ	PRODUCTION
Nov 23, 2010 - 10_0004 Halogen Free Material Change for SOIC Narrow Body Products Assembled at Amkor
		PCN10_0004_Form Material_Report ADI0012 Reliability Report
AMP03GSZ	PRODUCTION
AMP03GSZ-RL	PRODUCTION

This is the most up-to-date revision of the Data Sheet.

Latest Discussions

1 Years Ago

AMP03

Part Details

Documentation

Data Sheet 2

Application Note 5

Technical Articles 4

Technical Book 1

Latest Discussions

Recently Viewed