Analog Devices RF and microwave components are available as drop-in X-MWblocks^®
from Quantic^™ X-Microwave.

Get the X-MWblock® drop-in module for this part.

ADPA7007

RECOMMENDED FOR NEW DESIGNS

GaAs, pHEMT, MMIC,1 W Power Amplifier, 18 GHz to 44 GHz

Data Sheet (Rev. 0) Product Selection Table

Part Models: 4
1ku List Price: Starting From $159.79

Viewing:

Part Details

Output P1dB: 31 dBm typical at 22 GHz to 36 GHz
P_SAT: 32 dBm typical at 22 GHz to 36 GHz
Gain: 21.5 dB typical at 22 GHz to 36 GHz
Output IP3: 41 dBm typical at 22 GHz to 44 GHz

Supply voltage: 5 V typical at 1400 mA maximum
50 Ω matched input and output
Die size: 3.610 mm × 3.610 mm × 0.102 mm

Part Models: 4
1ku List Price: Starting From $159.79

Documentation

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
ADPA7007AEHZ	18-Lead LCC (7mm x 7mm x 1.32mm w/EP)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADPA7007AEHZ-R7	18-Lead LCC (7mm x 7mm x 1.32mm w/EP)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADPA7007C-KIT	CHIPS OR DIE	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADPA7007CHIP	CHIPS OR DIE	Material Declaration Reliablity Data	Ultra Librarian SamacSys

This is the most up-to-date revision of the Data Sheet.

Tools & Simulations

S-Parameter 2

Evaluation Kits

ADPA7007 Evaluation Board

Buy Now View Details

Features and Benefits

2-layer Rogers 4350B evaluation board with heat sink
End launch 2.9 mm RF connectors
Through calibration path

Product Details

The ADPA7007-EVALZ consists of a 2-layer printed circuit board (PCB) fabricated from 10 mil thick Rogers 4350B copper clad mounted to an aluminum heat sink. The ADPA7007-EVALZ uses the same PCB as the ADPA7005-EVALZ but with the ADPA7007 populated on the board. The heat sink assists in providing thermal relief to the ADPA7007 as well as mechanical support to the PCB. Mounting holes on the heat sink allow it to be attached to larger heat sinks for improved thermal management. The RFIN and RFOUT ports are populated by 2.9 mm female coaxial connectors and their respective RF traces are of 50 Ω characteristic impedance. The board is populated with components suitable for use over the entire operating temperature range of the device.

RF traces are 50 Ω grounded coplanar waveguide. Package ground leads and the exposed pad connect directly to the ground plane. Multiple vias are used to connect the top and bottom ground planes, with particular focus on the area directly beneath the ground paddle to provide adequate electrical conduction and thermal conduction to the heat sink.

The power supply decoupling capacitors on the evaluation board represent the configuration that was used to characterize and qualify the device. The number of capacitors can be reduced but this scope varies from system to system. The general guidance is to first remove or combine the largest capacitors that are farthest from the device.

Consult the ADPA7007 data sheet in conjunction with this user guide when working with the ADPA7007-EVALZ board.

Resources

UG-1685: Evaluating the ADPA7007 20 GHz to 44 GHz, GaAs, pHEMT, 31.5 dBm (>1 W), MMIC Power Amplifier (Rev.0)
227.88 K

ADPA7007 Gerber Files
6.73 M

Latest Discussions

4 Years Ago

ADPA7007

Part Details

Documentation

Data Sheet 2

User Guide 1

Application Note 2

Evaluation Design File 1

Product Selection Guide 1