ADG413
PRODUCTIONLC2MOS Precision Quad SPST Switch
- Part Models
- 6
- 1ku List Price
- Starting From $3.22
Part Details
- 44 V Supply Maximum Ratings
- Low On-Resistance (< 35 Ω)
- Fast Switching Times
tON <175 ns
tOFF <145 ns
- ± 15 V Analog Signal Range
- Rail-to-Rail Switching Operation
- Ultralow Power Dissipation (<35 µW )
- TTL/CMOS-Compatible Inputs
- Plug-In Replacement for DG411/DG412/DG413
- 16-Lead DIP and SOIC Packages
The ADG413 is a monolithic CMOS device comprising four independently selectable switches. It is designed on an enhanced LC2MOS process which provides low power dissipation yet gives high switching speed and low on resistance.
The ADG413 has two switches that are turned on with a logic high on the appropriate control inputs while the logic is inverted on the other two switches. Each switch conducts equally well in both directions when ON and each has an input signal range that extends to the supplies. All switches exhibit break-before-make switching action for use in multiplexer applications. Inherent in the design is low charge injection for minimum transients when switching the digital inputs.
Documentation
Data Sheet 1
User Guide 1
Technical Articles 3
Product Selection Guide 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
ADG413BNZ | 16-Lead PDIP | ||
ADG413BRUZ | 16-Lead TSSOP | ||
ADG413BRUZ-REEL | 16-Lead TSSOP | ||
ADG413BRUZ-REEL7 | 16-Lead TSSOP | ||
ADG413BRZ | 16-Lead SOIC | ||
ADG413BRZ-REEL | 16-Lead SOIC |
Part Models | Product Lifecycle | PCN |
---|---|---|
Mar 29, 2021 - 21_0033 Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek |
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ADG413BNZ | ||
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
||
ADG413BNZ | ||
Apr 5, 2021 - 21_0035 Amkor Philippines as an Alternate Site for TSSOP_4.4 |
||
ADG413BRUZ | ||
ADG413BRUZ-REEL | ||
ADG413BRUZ-REEL7 | ||
Jan 20, 2012 - 11_0218 Halogen Free Material Change for Certain TSSOP Products at Carsem |
||
ADG413BRUZ | ||
ADG413BRUZ-REEL | ||
ADG413BRUZ-REEL7 | ||
Mar 25, 2021 - 21_0080 Amkor Philippines as an Alternate Site for SOICN |
||
ADG413BRZ | ||
ADG413BRZ-REEL | ||
Feb 6, 2014 - 13_0234 Qualification of ASE Chungli, as an Alternate Assembly Site for Select 16L SOICN Packages |
||
ADG413BRZ | ||
ADG413BRZ-REEL | ||
Oct 5, 2010 - 10_0146 Halogen Free Material Change for 14/16L SOIC_N Products |
||
ADG413BRZ | ||
ADG413BRZ-REEL | ||
Feb 8, 2010 - 04_0080 Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland. |
||
ADG413BRZ | ||
ADG413BRZ-REEL |
This is the most up-to-date revision of the Data Sheet.