AD7870
PRODUCTIONComplete 12-Bit, 100 kHz, Sampling ADC (AD7870/AD7870A)
- Part Models
- 12
- 1ku List Price
- Starting From $50.33
Part Details
- Complete Monolithic 12-Bit ADC with:
2 µs Track/Hold Amplifier
8 µs A/D Converter
On-Chip Reference
Laser-Trimmed Clock
Parallel, Byte and Serial Digital Interface - 57 ns Data Access Time
- 72 dB SNR at 10 kHz Input Frequency
(AD7870, AD7875) - Low Power: –60 mW typ
- Variety of Input Ranges:
±3 V for AD7870
0 V to +5 V for AD7875
±10 V for AD7876
The AD7870 / AD7875 / AD7876 is a fast, complete, 12-bit A/D converter. It consists of a track/hold amplifier, 8 µs successive approximation ADC, 3 V buried Zener reference and versatile interface logic. The ADC features a self-contained internal clock which is laser trimmed to guarantee accurate control of conversion time. No external clock timing components are required; the on-chip clock may he overridden by an external clock if required.
The parts offer a choice of three data output formats: a single, parallel, 12-bit word; two 8-bit bytes or serial data. Fast bus access times and standard control inputs ensure easy interfacing to modern microprocessors and digital signal processors.
All parts operate from ±5 V power supplies. The AD7870 and AD7876 accept input signal ranges of ±3 V and ±10 V, respectively, while the AD7875 accepts a unipolar 0 V to +5 V input range. The parts can convert full power signals up to 50 kHz.
The AD7870 / AD7875 / AD7876 feature dc accuracy specifications such as linearity, full-scale and offset error. In addition, the AD7870 and AD7875 are fully specified for dynamic performance parameters including distortion and signal-to-noise ratio.
The parts are available in a 24-pin, 0.3 inch-wide, plastic or hermetic dual-in-line package (DIP). The AD7870 and AD7875 are available in a 28-pin plastic leaded chip carrier (PLCC), while the AD7876 is available and in a 24-pin small outline (SOIC) package.
Documentation
Data Sheet 3
Technical Articles 1
Analog Dialogue 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| 5962-9063201M3A | 28 ld LCC | ||
| 5962-9063201MLA | 24 ld CerDIP(300 Mil) | ||
| AD7870BQ | 24 ld CerDIP(300 Mil) | ||
| AD7870CQ | 24 ld CerDIP(300 Mil) | ||
| AD7870JNZ | 24-Lead PDIP | ||
| AD7870JPZ | 28 ld PLCC | ||
| AD7870JPZ-REEL | 28 ld PLCC | ||
| AD7870KNZ | 24-Lead PDIP | ||
| AD7870KPZ | 28 ld PLCC | ||
| AD7870KPZ-REEL | 28 ld PLCC | ||
| AD7870LNZ | 24-Lead PDIP | ||
| AD7870LPZ | 28 ld PLCC |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Apr 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
||
| 5962-9063201M3A | ||
| 5962-9063201MLA | ||
|
Feb 28, 2018 - 18_0013 Transfer of AD7870 MIL models from 4" to 8" Wafer Fab. |
||
| 5962-9063201M3A | ||
| 5962-9063201MLA | ||
|
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
||
| 5962-9063201M3A | ||
| 5962-9063201MLA | ||
| AD7870BQ | ||
| AD7870CQ | ||
|
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
||
| 5962-9063201M3A | ||
| 5962-9063201MLA | ||
| AD7870BQ | ||
| AD7870CQ | ||
|
Feb 8, 2010 - 04_0080 Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland. |
||
| 5962-9063201M3A | ||
| 5962-9063201MLA | ||
| AD7870BQ | ||
| AD7870CQ | ||
| AD7870JNZ | PRODUCTION | |
| AD7870JPZ | PRODUCTION | |
| AD7870KNZ | PRODUCTION | |
| AD7870KPZ | PRODUCTION | |
| AD7870KPZ-REEL | PRODUCTION | |
| AD7870LNZ | PRODUCTION | |
| AD7870LPZ | PRODUCTION | |
|
Nov 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
||
| 5962-9063201MLA | ||
| AD7870BQ | ||
| AD7870CQ | ||
|
Feb 3, 2009 - 08_0001 Qualification of 8" 3um BiCMOS wafer fab process at Analog Devices, Limerick, Ireland. |
||
| AD7870BQ | ||
| AD7870CQ | ||
| AD7870JNZ | PRODUCTION | |
| AD7870JPZ | PRODUCTION | |
| AD7870KNZ | PRODUCTION | |
| AD7870KPZ | PRODUCTION | |
| AD7870KPZ-REEL | PRODUCTION | |
| AD7870LNZ | PRODUCTION | |
| AD7870LPZ | PRODUCTION | |
|
Mar 7, 2019 - 19_0046 Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek |
||
| AD7870JNZ | PRODUCTION | |
| AD7870KNZ | PRODUCTION | |
| AD7870LNZ | PRODUCTION | |
|
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
||
| AD7870JNZ | PRODUCTION | |
| AD7870KNZ | PRODUCTION | |
| AD7870LNZ | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.