AD7821
NOT RECOMMENDED FOR NEW DESIGNSHigh Speed, µP-Compatible, CMOS, 8-Bit Sampling ADC
- Part Models
- 9
- 1ku List Price
- Starting From $18.97
Part Details
- Fast Conversion Time: 660 ns Max
- 100 kHz Track-and-Hold Function
- 1 MHz Sample Rate
- Unipolar and Bipolar Input Ranges
- Ratiometric Reference Inputs
- No External Clock
- Extended Temperature Range Operation
- Skinny 20-Lead DIPs, SOIC, and
Surface-Mount Packages
The AD7821 is a high-speed, 8-bit, sampling, analog-to-digital converter that offers improved performance over the popular AD7820. It offers a conversion time of 660 ns (vs. 1.36 µs for the AD7820) and 100 kHz signal bandwidth (vs. 6.4 kHz). The sampling instant is better defined and occurs on the falling edge of WR or RD. The provision for a VSS pin (Pin 19) allows the part to operate from ±5 V supplies and to digitize bipolar input signals. Alternatively, for unipolar inputs, the VSS pin can be grounded and the AD7821 will operate from a single +5 V supply, like the AD7820.
The AD7821 has a built-in track-and-hold function capable of digitizing full-scale signals up to 100 kHz max. It also uses a half-flash conversion technique that eliminates the need to generate a CLK signal for the ADC.
The AD7821 is designed with standard microprocessor control signals (CS, RD, WR, RDY, INT) and latched, three-state data outputs capable of interfacing to high-speed data buses. An overflow output (OFL) is also provided for cascading devices to achieve higher resolution.
The AD7821 is fabricated in Linear-Compatible CMOS (LC2MOS), an advanced, mixed technology process combining precision bipolar circuits with low-power CMOS logic. The part features a low power dissipation of 50 mW.
Documentation
Data Sheet 2
Application Note 1
Technical Articles 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| 5962-89518012A | 20-Lead LCC | ||
| 5962-8951801RA | 20-Lead CerDIP | ||
| AD7821BQ | 20-Lead CerDIP | ||
| AD7821KNZ | 20-Lead PDIP | ||
| AD7821KPZ | 20-Lead Flatpack | ||
| AD7821KPZ-REEL | 20-Lead Flatpack | ||
| AD7821KRZ | 20-Lead SOIC (Wide) | ||
| AD7821KRZ-REEL | 20-Lead SOIC (Wide) | ||
| AD7821TQ | 20-Lead CerDIP |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Apr 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
||
| 5962-89518012A | ||
| 5962-8951801RA | ||
|
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
||
| 5962-89518012A | ||
| 5962-8951801RA | ||
| AD7821BQ | ||
| AD7821TQ | ||
|
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
||
| 5962-89518012A | ||
| 5962-8951801RA | ||
| AD7821BQ | ||
| AD7821TQ | ||
|
Feb 1, 2010 - 10_0020 Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility. |
||
| 5962-89518012A | ||
|
Feb 3, 2009 - 08_0001 Qualification of 8" 3um BiCMOS wafer fab process at Analog Devices, Limerick, Ireland. |
||
| 5962-89518012A | ||
| 5962-8951801RA | ||
| AD7821BQ | ||
| AD7821KNZ | ||
| AD7821KPZ | ||
| AD7821KPZ-REEL | ||
| AD7821KRZ | ||
| AD7821KRZ-REEL | ||
| AD7821TQ | ||
|
Nov 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
||
| 5962-8951801RA | ||
| AD7821BQ | ||
| AD7821TQ | ||
|
Mar 7, 2019 - 19_0046 Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek |
||
| AD7821KNZ | ||
|
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
||
| AD7821KNZ | ||
|
Feb 7, 2011 - 10_0003 Halogen Free Material Change for SOIC Wide Body Products Assembled at Amkor |
||
| AD7821KRZ | ||
| AD7821KRZ-REEL | ||
This is the most up-to-date revision of the Data Sheet.