AD7811
PRODUCTION10-Bit, 4-Channel, 350 kSPS, Serial A/D Converter
- Part Models
- 5
- 1ku List Price
- Starting From $5.60
Part Details
- 10-Bit ADC with 2.3 µs Conversion Time
- Four Single-Ended Inputs to Configure as Three Pseudo Differential Inputs with Respect to a Common, or as Two Independent Pseudo Differential Channels
- Onboard Track and Hold
- Onboard Reference 2.5 V ± 2.5%
- Operating Supply Range: 2.7 V to 5.5 V
- Specifications at 2.7 V–3.6 V and 5 V ± 10%
- DSP-/Microcontroller-Compatible Serial Interface
- High Speed Sampling and Automatic
- Power-Down Modes
- Package Address Pin on AD7811 and AD7812 Allows Sharing of Serial Bus in Multipackage Applications
- Input Signal Range: 0 V to VREF
- Reference Input Range: 1.2 V to VDD
- Qualified for Automotive Applications
The AD7811 and AD7812 are high speed, low power, 10-bit A/D converters that operate from a single 2.7 V to 5.5 V supply. The devices contain a 2.3 µs successive approximation A/D converter, an on-chip track/hold amplifier, a 2.5 V on-chip reference and a high speed serial interface that is compatible with the serial interfaces of most DSPs (Digital Signal Processors) and microcontrollers. The user also has the option of using an external reference by connecting it to the VREF pin and setting the EXTREF bit in the control register. The VREF pin may be tied to VDD. At slower throughput rates the power-down mode may be used to automatically power down between conversions.
The control registers of the AD7811 and AD7812 allow the input channels to be configured as single-ended or pseudo differential. The control register also features a software convert start and a software power-down. Two of these devices can share the same serial bus and may be individually addressed in a multipackage application by hardwiring the device address pin. The AD7811 is available in a small, 16-lead 0.3" wide, plastic dual-in-line package (mini-DIP), in a 16-lead 0.15" wide, small outline IC (SOIC) and in a 16-lead, Thin Shrink Small Outline Package (TSSOP). The AD7812 is available in a small, 20-lead 0.3" wide, plastic dual-in-line package (mini-DIP), in a 20-lead, small outline IC (SOIC) and in a 20-lead, Thin Shrink Small Outline Package (TSSOP).
PRODUCT HIGHLIGHTS
- Low Power, Single Supply Operation
Both the AD7811 and AD7812 operate from a single 2.7 V to 5.5 V supply and typically consume only 10 mW of power. The power dissipation can be significantly reduced at lower throughput rates by using the automatic power-down mode e.g., 315 µW @ 10 kSPS, VDD = 3 V—see Power vs. Throughput. - 4-/8-Channel, 10-Bit ADC
The AD7811 and AD7812 have four and eight single-ended input channels respectively. These inputs can be configured as pseudo differential inputs by using the Control Register. - On-chip 2.5 V (±2.5%) reference circuit that is powered down when using an external reference.
- Hardware and Software Control
The AD7811 and AD7812 provide for both hardware and software control of Convert Start and Power-Down.
Documentation
Data Sheet 1
Technical Articles 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| AD7811YNZ | 16-Lead PDIP | ||
| AD7811YRUZ | 16-Lead TSSOP | ||
| AD7811YRUZ-REEL7 | 16-Lead TSSOP | ||
| AD7811YRZ | 16-Lead SOIC | ||
| AD7811YRZ-REEL | 16-Lead SOIC |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Mar 29, 2021 - 21_0033 Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek |
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| AD7811YNZ | PRODUCTION | |
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Feb 8, 2010 - 04_0080 Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland. |
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| AD7811YNZ | PRODUCTION | |
| AD7811YRUZ | PRODUCTION | |
| AD7811YRUZ-REEL7 | PRODUCTION | |
| AD7811YRZ | PRODUCTION | |
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Jan 25, 2010 - 09_0116 Transfer of AD7810 and AD7823 wafer fabrication to TSMC, Taiwan. |
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| AD7811YNZ | PRODUCTION | |
| AD7811YRUZ | PRODUCTION | |
| AD7811YRUZ-REEL7 | PRODUCTION | |
| AD7811YRZ | PRODUCTION | |
| AD7811YRZ-REEL | PRODUCTION | |
|
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
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| AD7811YNZ | PRODUCTION | |
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Feb 11, 2011 - 10_0005 Halogen Free Material Change for TSSOP Products Assembled at Amkor |
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| AD7811YRUZ | PRODUCTION | |
| AD7811YRUZ-REEL7 | PRODUCTION | |
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Feb 6, 2014 - 13_0234 Qualification of ASE Chungli, as an Alternate Assembly Site for Select 16L SOICN Packages |
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| AD7811YRZ | PRODUCTION | |
| AD7811YRZ-REEL | PRODUCTION | |
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Oct 5, 2010 - 10_0146 Halogen Free Material Change for 14/16L SOIC_N Products |
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| AD7811YRZ | PRODUCTION | |
| AD7811YRZ-REEL | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.