AD7302
PRODUCTION2.7 V to 5.5 V, Parallel Input Dual Voltage Output 8-Bit DAC
- Part Models
- 7
- 1ku List Price
- Starting From $3.68
Part Details
- Two 8-Bit DACs in One Package
- 20-Lead DIP/SOIC/TSSOP Package
- +2.7 V to +5.5 V Operation
- Internal and External Reference Capability
- DAC Power-Down Function
- Parallel Interface
- On-Chip Output Buffer Rail-to-Rail Operation
- Low power Operation 3 mA max @ 3.3 V
- Power-Down to 1 µA max @ 25°C
The AD7302 is a dual, 8-bit voltage out DAC that operates from a single +2.7 V to +5.5 V supply. Its on-chip precision output buffers allow the DAC outputs to swing rail to rail. The AD7302 has a parallel microprocessor and DSP-compatible interface with high speed registers and double buffered interface logic. Data is loaded to the registers on the rising edge of CS or WR and the A/B pin selects either DAC A or DAC B.
Reference selection for AD7302 can be either an internal reference derived from the VDD or an external reference applied at the REFIN pin. Both DACs can be simultaneously updated using the asynchronous LDAC input and can be cleared by using the asynchronous CLR input.
The low power consumption of this part makes it ideally suited to portable battery operated equipment. The power consumption is less than 10 mW at 3.3 V, reducing to 3 µW in powerdown mode.
The AD7302 is available in a 20-pin plastic dual-in-line package, 20-lead SOIC and a 20-lead TSSOP package.
APPLICATIONS
- Portable Battery Powered Instruments
- Digital Gain and Offset Adjustment
- Programmable Voltage and Current Sources
- Programmable Attenuators
PRODUCT HIGHLIGHTS
- Low Power, Single Supply Operation. This part operates from a single +2.7 V to +5.5 V supply and typically consumes 15 mW at 5 V, making it ideal for battery powered applications.
- The on-chip output buffer amplifiers allow the outputs of the DACs to swing rail to rail with a settling time of typically 1.2 µs.
- Internal or external reference capability.
- High speed parallel interface.
- Power-Down Capability. When powered down the DAC consumes less than 1 µA at 25°C.
- Packaged in 20-lead DIP, SOIC and TSSOP packages.
Documentation
Data Sheet 1
Solutions Bulletin & Brochure 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
AD7302BNZ | 20-Lead PDIP | ||
AD7302BRUZ | 20-Lead TSSOP | ||
AD7302BRUZ-REEL | 20-Lead TSSOP | ||
AD7302BRUZ-REEL7 | 20-Lead TSSOP | ||
AD7302BRZ | 20-Lead SOIC (Wide) | ||
AD7302BRZ-REEL | 20-Lead SOIC (Wide) | ||
AD7302BRZ-REEL7 | 20-Lead TSSOP |
Part Models | Product Lifecycle | PCN |
---|---|---|
Mar 7, 2019 - 19_0046 Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek |
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AD7302BNZ | PRODUCTION | |
Feb 8, 2010 - 04_0080 Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland. |
||
AD7302BNZ | PRODUCTION | |
AD7302BRUZ | PRODUCTION | |
AD7302BRUZ-REEL | PRODUCTION | |
AD7302BRUZ-REEL7 | PRODUCTION | |
AD7302BRZ | PRODUCTION | |
AD7302BRZ-REEL7 | PRODUCTION | |
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
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AD7302BNZ | PRODUCTION | |
Feb 11, 2011 - 10_0005 Halogen Free Material Change for TSSOP Products Assembled at Amkor |
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AD7302BRUZ | PRODUCTION | |
AD7302BRUZ-REEL | PRODUCTION | |
AD7302BRUZ-REEL7 | PRODUCTION | |
Feb 7, 2011 - 10_0003 Halogen Free Material Change for SOIC Wide Body Products Assembled at Amkor |
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AD7302BRZ | PRODUCTION | |
AD7302BRZ-REEL | PRODUCTION | |
AD7302BRZ-REEL7 | PRODUCTION |
This is the most up-to-date revision of the Data Sheet.