AD674B
PRODUCTIONComplete 12-Bit A/D Converters
- Part Models
- 11
- 1ku List Price
- Starting From $40.02
Part Details
- Complete Monolithic 12-Bit A/D Converters with Reference, Clock, and Three-State Output Buffers
- Industry Standard Pinout
- High Speed Upgrades for AD574A
- 8- and 16-Bit Microprocessor Interface
- 8 µs (Max) Conversion Time (AD774B)
- 15 µs (Max) Conversion Time (AD674B)
- ±5 V, ±10 V, 0 V–10 V, 0 V–20 V Input Ranges
- Commercial, Industrial, and Military Temperature Range Grades
- MIL-STD-883-Compliant Versions Available
The AD674B and AD774B are complete 12-bit successive approximation analog-to-digital converters with three-state output buffer circuitry for direct interface to 8- and 16-bit microprocessor busses. A high precision voltage reference and clock are included on chip, and the circuit requires only power supplies and control signals for operation.
The AD674B and AD774B are pin compatible with the industry standard AD574A, but offer faster conversion time and access speed than the AD574A and lower power consumption. The AD674B converts in 15 µs (maximum) and the AD774B converts in 8 µs (maximum).
The monolithic design is implemented using Analog Devices' BiMOS II process allowing high performance bipolar analog circuitry to be combined on the same die with digital CMOS logic. Offset linearity and scaling errors are minimized by active trimming of thin-film resistors.
Five different grades are available. The J and K grades are specified for operation over the 0°C to +70°C temperature range. A and B grades are specified from -40°C to +85°C, the T is specified from -55°C to +125°C. The J and K grades are available in a 28-pin plastic DIP or 28-lead SOIC. All other grades are available in a 28-pin hermetically sealed ceramic DIP.
Documentation
Data Sheet 2
Technical Articles 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| 5962-9169003M3A | 28 ld LCC | ||
| 5962-9169003MXA | 28 ld Side-Brazed CerDIP | ||
| AD674BAD | 28 ld Side-Brazed CerDIP | ||
| AD674BARZ | 28-Lead SOIC (Wide) | ||
| AD674BBD | 28 ld Side-Brazed CerDIP | ||
| AD674BBRZ | 28-Lead SOIC (Wide) | ||
| AD674BJNZ | 28-Lead PDIP | ||
| AD674BKNZ | 28-Lead PDIP | ||
| AD674BTD | 28 ld Side-Brazed CerDIP | ||
| AD674BTD/883B | 28 ld Side-Brazed CerDIP | ||
| AD674BTE/883B | 28 ld LCC |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Apr 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
||
| 5962-9169003M3A | ||
| 5962-9169003MXA | ||
| AD674BTD/883B | ||
| AD674BTE/883B | ||
|
Jun 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite |
||
| 5962-9169003M3A | ||
| AD674BTE/883B | ||
|
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
||
| 5962-9169003M3A | ||
| 5962-9169003MXA | ||
| AD674BAD | ||
| AD674BBD | ||
| AD674BTD | ||
| AD674BTD/883B | ||
| AD674BTE/883B | ||
|
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
||
| 5962-9169003M3A | ||
| 5962-9169003MXA | ||
| AD674BAD | ||
| AD674BBD | ||
| AD674BTD | ||
| AD674BTD/883B | ||
| AD674BTE/883B | ||
|
Feb 1, 2010 - 10_0020 Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility. |
||
| 5962-9169003MXA | ||
| AD674BTD/883B | ||
|
Aug 4, 2010 - 10_0117 Halogen Free Material Change for SOIC_W Products at Carsem |
||
| AD674BARZ | ||
| AD674BBRZ | ||
|
Mar 7, 2019 - 19_0046 Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek |
||
| AD674BJNZ | ||
| AD674BKNZ | ||
|
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
||
| AD674BJNZ | ||
| AD674BKNZ | ||
This is the most up-to-date revision of the Data Sheet.