ADRF5532
RECOMMENDED FOR NEW DESIGNS2.3 GHz to 2.7 GHz, Receiver Front End
- Part Models
- 3
- 1ku List Price
- Starting From $7.95
Part Details
- Integrated RF front end
- LNA and high-power silicon SPDT switch
- On-chip bias and matching
- Single-supply operation
- Gain: 35.5 dB typical at 2.6 GHz
- Gain flatness: 0.2 dB at 25°C across 400 MHz bandwidth
- Low noise figure: 1.2 dB typical at 2.6 GHz
- Low insertion loss: 0.7 dB typical at 2.6 GHz
- High-power handling at TCASE = 105°C
- Full lifetime
- LTE average power (8 dB PAR): 36.5 dBm
- Single event (<10 sec operation)
- LTE average power (8 dB PAR): 39 dBm
- High Input IP3: −4 dBm
- Low-supply current
- Receive operation: 118 mA typical at 5 V
- Transmit operation: 15 mA typical at 5 V
- Positive logic control
- 5 mm × 3 mm, 24-lead LFCSP package
- Pin compatible with the ADRF5534, 3.1 GHz to 4.2 GHz receiver front end
The ADRF5532 is an integrated RF, front-end multichip module designed for time division duplex (TDD) applications. The device operates from 2.3 GHz to 2.7 GHz. The ADRF5532 is configured with a low-noise amplifier (LNA) and a high-power, silicon, single pole double throw (SPDT) switch.
In the receive operation at 2.6 GHz, the LNA offers a low noise figure (NF) of 1.2 dB and a high gain of 35.5 dB with a third order input intercept point (IIP3) of −4 dBm.
In the transmit operation, the switch provides a low insertion loss of 0.7 dB and handles a long-term evolution (LTE) average power of 36.5 dBm for a full lifetime operation (8 dB peak to average ratio (PAR)) and 39 dBm for a single event (<10 sec) LNA protection operation.
The device is featured in an RoHS compliant, compact, 5 mm × 3 mm, 24-lead LFCSP package.
APPLICATIONS
- Wireless infrastructure
- TDD massive multiple input and multiple output (MIMO) and active antenna systems
- TDD-based communication systems
Documentation
Data Sheet 1
User Guide 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
ADRF5532BCPZN | 24-lead LFCSP (5 mm x 3 mm x 0.95 mm) | ||
ADRF5532BCPZN-R7 | 24-lead LFCSP (5 mm x 3 mm x 0.95 mm) | ||
ADRF5532BCPZN-RL | 24-lead LFCSP (5 mm x 3 mm x 0.95 mm) |
This is the most up-to-date revision of the Data Sheet.
Tools & Simulations
S-Parameter 1
Evaluation Kits
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