ADRF5515A
RECOMMENDED FOR NEW DESIGNSDual-Channel, 3.3 GHz to 4.0 GHz, 20 W Receiver Front End
- Part Models
- 3
- 1ku List Price
- price unavailable
Part Details
- Integrated dual-channel RF front end
- 2-stage LNA and high power silicon SPDT switch
- On-chip bias and matching
- Single-supply operation
- High power handling at TCASE = 105°C
- LTE average power (9 dB PAR) full lifetime: 43 dBm
- Gain
- High gain mode: 36 dB typical at 3.6 GHz
- Low gain mode: 17 dB typical at 3.6 GHz
- Low noise figure
- High gain mode: 1.05 dB typical at 3.6 GHz
- Low gain mode: 1.05 dB typical at 3.6 GHz
- High isolation
- RXOUT-CHA and RXOUT-CHB: 47 dB typical
- TERM-CHA and TERM-CHB: 75 dB typical
- Low insertion loss: 0.5 dB typical at 3.6 GHz
- High OIP3: 35 dBm typical
- Power-down mode and low gain mode
- Low supply current
- High gain mode: 95 mA typical at 5 V
- Low gain mode: 48 mA typical at 5 V
- Power-down mode: 13 mA typical at 5 V
- Positive logic control
- 6 mm × 6 mm, 40-lead LFCSP package
- Pin compatible with the ADRF5515 and the ADRF5519, and the 10 W versions, ADRF5545A and ADRF5549
The ADRF5515A is a dual-channel, integrated RF, front-end, multichip module designed for time division duplexing (TDD) applications. The device operates from 3.3 GHz to 4.0 GHz. The ADRF5515A is configured in dual channels with a cascading, two-stage low noise amplifier (LNA) and a high-power silicon singlepole, double-throw (SPDT) switch.
In high gain mode, the cascaded two-stage LNA and switch offer a low noise figure of 1.05 dB and a high gain of 36 dB at 3.6 GHz, with an output third-order intercept (OIP3) point of 35 dBm (typical). In low gain mode, one stage of the two-stage LNA is in bypass, providing 17 dB of gain at a lower current of 48 mA. In power-down mode, the LNAs are turned off and the device draws 13 mA.
In transmit operation, when RF inputs are connected to a termination pin (TERM-CHA or TERM-CHB), the switch provides low insertion loss of 0.5 dB and handles long-term evolution (LTE) average power (9 dB peak to average ratio (PAR)) of 43 dBm for full lifetime operation.
The device comes in an RoHS-compliant, compact, 6 mm × 6 mm, 40-lead lead frame chip scale package (LFCSP).
APPLICATION
Documentation
Data Sheet 1
User Guide 1
Product Selection Guide 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
ADRF5515ABCPZN | 40-Lead LFCSP (6mm x 6mm w/ EP) | ||
ADRF5515ABCPZN-R7 | 40-Lead LFCSP (6mm x 6mm w/ EP) | ||
ADRF5515ABCPZN-RL | 40-Lead LFCSP (6mm x 6mm w/ EP) |
This is the most up-to-date revision of the Data Sheet.
Tools & Simulations
S-Parameter 1
Evaluation Kits
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