ADPA7009-2

RECOMMENDED FOR NEW DESIGNS

20 GHz to 54 GHz, GaAs, pHEMT, MMIC, 29 dBm (0.5 W) Power Amplifier

Part Models
2
1ku List Price
Starting From $206.27
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Part Details

  • Integrated power-supply capacitors and bias inductors
  • Integrated AC coupling capacitors
  • Gain: 17.5 dB typical at 20 GHz to 35 GHz
  • Input return loss: 14 dB typical at 20 GHz to 35 GHz
  • Output return loss: 15 dB typical at 20 GHz to 35 GHz
  • OP1dB: 28 dBm typical at 20 GHz to 35 GHz
  • PSAT: 28.5 dBm typical at 20 GHz to 35 GHz
  • OIP3: 34.5 dBm typical at 20 GHz to 35 GHz
  • Noise figure: 7.5 dB typical at 20 GHz to 35 GHz
  • 5 V supply voltage at 850 mA
  • 50 Ω matched input and output
  • 5.00 mm × 5.00 mm, 24-terminal chip array, small outline, no lead cavity [LGA_CAV] package
ADPA7009-2
20 GHz to 54 GHz, GaAs, pHEMT, MMIC, 29 dBm (0.5 W) Power Amplifier
ADPA7009-2 Functional Block Diagram ADPA7009-2 Pin Configuration
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Tools & Simulations


Evaluation Kits

eval board
EVAL-ADPA7009-2

Evaluating the ADPA7009-2 20 GHz to 54 GHz, GaAs, pHEMT, MMIC, 29 dBm (0.5 W) Power Amplifier

Features and Benefits

  • 2-layer Rogers 4350B evaluation board with heat spreader
  • End launch 1.85 mm RF connectors
  • Through calibration path

Product Details

The ADPA7009-2-EVALZ consists of a 2-layer printed circuit board (PCB) fabricated from 10 mil thick Rogers 4350B copper clad mounted to an aluminum heat spreader. The heat spreader assists in providing thermal relief to the ADPA7009-2 as well as mechanical support to the PCB. Mounting holes on the heat spreader allow it to be attached to larger heat sinks for improved thermal management. The RFIN and RFOUT ports are populated by 1.85 mm female coaxial connectors, and their respective RF traces are of 50 Ω characteristic impedance. The ADPA7009-2-EVALZ is populated with components suitable for use over the entire operating temperature range of the ADPA7009.

RF traces are 50 Ω grounded coplanar waveguide. Package ground leads and the exposed pad connect directly to the ground plane. Multiple vias are used to connect the top and bottom ground planes, with particular focus on the area directly beneath the ground paddle to provide adequate electrical conduction and thermal conduction to the heat spreader.

The power supply decoupling capacitors shown in Figure 4 of the user guide represent the configuration that was used to characterize and qualify the device. It is possible to reduce the number of capacitors; however, this reduction varies by system. It is instead recommended to first remove or combine the largest capacitors that are farthest from the device.

Consult the ADPA7009 data sheet in conjunction with the user guide when working with the ADPA7009-2-EVALZ board.

EVAL-ADPA7009-2
Evaluating the ADPA7009-2 20 GHz to 54 GHz, GaAs, pHEMT, MMIC, 29 dBm (0.5 W) Power Amplifier
ADPA7009-2 Evaluation Board - Angle ADPA7009-2 Evaluation Board - Top ADPA7009-2 Evaluation Board - Bottom

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