ADPA7008
RECOMMENDED FOR NEW DESIGNS20 GHz to 54 GHz, GaAs, pHEMT, MMIC, 31 dBm (1 W) Power Amplifier
- Part Models
- 4
- 1ku List Price
- Starting From $227.13
Part Details
ADPA7008 Chip Features
- Output P1dB: 30.5 dBm typical at 22 GHz to 42 GHz
- PSAT: 31 dBm typical at 22 GHz to 42 GHz
- Gain: 18 dB typical at 22 GHz to 42 GHz
- Input return loss: 22 dB typical at 22 GHz to 42 GHz
- Output return loss: 23 dB typical at 22 GHz to 42 GHz
- Output IP3: 38 dBm typical at 22 GHz to 42 GHz
- Supply voltage: 5 V typical at 1500 mA
- 50 Ω matched input and output
- Die size: 3.610 mm × 3.610 mm × 0.102 mm
ADPA7008AEHZ Features
- Output P1dB: 30 dBm typical at 22 GHz to 40 GHz
- PSAT: 31 dBm typical at 22 GHz to 40 GHz
- Gain: 17.5 dB typical at 22 GHz to 40 GHz
- Input return loss: 12 dB typical at 22 GHz to 40 GHz
- Output return loss: 9.5 dB typical at 22 GHz to 40 GHz
- Output IP3: 37 dBm typical at 22 GHz to 40 GHz
- Supply voltage: 5 V typical at 1500 mA
- 50 Ω matched input and output
- 18-terminal, 7 mm × 7 mm, ceramic leadless chip carrier with heat sink [LCC_HS]
- Integrated power detector
The ADPA7008CHIP is a gallium arsenide (GaAs), pseudomorphic high electron mobility transistor (pHEMT), monolithic microwave integrated circuit (MMIC), 31 dBm saturated output power (1 W) distributed power amplifier that operates from 20 GHz to 54 GHz. The amplifier provides a gain of 18 dB, an output power for 1 dB compression (P1dB) of 30.5 dBm, and a typical output third-order intercept (IP3) of 38 dBm at 22 GHz to 42 GHz. The ADPA7008CHIP requires 1500 mA from a 5 V supply voltage (VDD) and features inputs and outputs that are internally matched to 50 Ω, facilitating integration into multichip modules (MCMs). All data is taken with the RFIN and RFOUT pads connected via one 0.076 mm (3 mil) ribbon bond of 0.076 mm (3 mil) minimal length.
APPLICATIONS
Documentation
Data Sheet 2
User Guide 1
Application Note 2
Product Selection Guide 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
ADPA7008AEHZ | 18-Lead LCC (7mm x 7mm x 1.32mm w/EP) | ||
ADPA7008AEHZ-R7 | 18-Lead LCC (7mm x 7mm x 1.32mm w/EP) | ||
ADPA7008C-KIT | CHIPS OR DIE | ||
ADPA7008CHIP | CHIPS OR DIE |
This is the most up-to-date revision of the Data Sheet.