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Analog Devices RF and microwave components are available as drop-in X-MWblocks®
from Quantic™ X-Microwave.
ADPA7002
RECOMMENDED FOR NEW DESIGNSGaAs, pHEMT, MMIC,1/2 W, 20 GHz to 44 GHz, Power Amplifier
- Part Models
- 4
- 1ku List Price
- Starting From $126.73
Part Details
- Output P1dB: 28 dBm (typical at 34 GHz to 44 GHz)
- PSAT: 30 dBm (typical at 20 GHz to 34 GHz)
- Gain: 15 dB (typical at 34 GHz to 44 GHz)
- IP3: 40 dBm (typical)
- Supply voltage: 5 V at 600 mA
- Die size: 2.75 mm × 1.805 mm × 0.1 mm
The ADPA7002CHIP is a gallium arsenide (GaAs), monolithic microwave integrated circuit (MMIC), pseudomorphic high electron mobility transistor (pHEMT), distributed power amplifier that operates from 20 GHz to 44 GHz. The amplifier provides 15 dB of small signal gain, 28 dBm output power at 1 dB gain compression (P1dB), and a typical output third-order intercept (IP3) of 40 dBm. The amplifier requires 600 mA from a 5 V supply on VDD2A, VDD2B, and VDD1. The ADPA7002CHIP also features inputs/outputs (I/Os) that are internally matched to 50 Ω, and facilitates integration into multichip modules (MCMs). All data is taken with the on substrate chip connected via two wire bonds that are 0.025 mm (1 mil) wide and 0.31 mm (12 mils) long.
Applications
- Military and space
- Test instrumentation
Documentation
Data Sheet 2
User Guide 1
Application Note 3
Product Selection Guide 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
ADPA7002AEHZ | 16-Lead LCC (6mm x 6mm x 1.32mm w/EP) | ||
ADPA7002AEHZ-R7 | 16-Lead LCC (6mm x 6mm x 1.32mm w/EP) | ||
ADPA7002C-KIT | CHIPS OR DIE | ||
ADPA7002CHIP | CHIPS OR DIE |
Part Models | Product Lifecycle | PCN |
---|---|---|
Jun 9, 2023 - 23_0129 ADPA7002 Die and Data Sheet Revision |
||
ADPA7002AEHZ | PRODUCTION | |
ADPA7002AEHZ-R7 | PRODUCTION | |
ADPA7002CHIP | PRODUCTION |
This is the most up-to-date revision of the Data Sheet.
Tools & Simulations
S-Parameter 2
Sys-Parameter Models for Keysight Genesys
Sys-Parameter models contain behavioral parameters, such as P1dB, IP3, gain, noise figure and return loss, which describe nonlinear and linear characteristics of a device.
Open ToolADIsimRF
ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.
Open Tool