Quantic X-Microwave

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ADPA7002

RECOMMENDED FOR NEW DESIGNS

GaAs, pHEMT, MMIC,1/2 W, 20 GHz to 44 GHz, Power Amplifier

Part Models
4
1ku List Price
Starting From $126.73
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Part Details

  • Output P1dB: 28 dBm (typical at 34 GHz to 44 GHz)
  • PSAT: 30 dBm (typical at 20 GHz to 34 GHz)
  • Gain: 15 dB (typical at 34 GHz to 44 GHz)
  • IP3: 40 dBm (typical)
  • Supply voltage: 5 V at 600 mA
  • Die size: 2.75 mm × 1.805 mm × 0.1 mm
ADPA7002
GaAs, pHEMT, MMIC,1/2 W, 20 GHz to 44 GHz, Power Amplifier
ADPA7002CHIP Functional Block Diagram ADPA7002CHIP Circuit Diagram ADPA7002CHIP Pin Configuration
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Tools & Simulations

S-Parameter 2

Sys-Parameter Models for Keysight Genesys

Sys-Parameter models contain behavioral parameters, such as P1dB, IP3, gain, noise figure and return loss, which describe nonlinear and linear characteristics of a device.

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ADIsimRF

ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.

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Evaluation Kits

eval board
EVAL-ADPA7002

ADPA7002 Evaluation Board

Features and Benefits

  • 2-layer Rogers 4350 evaluation board with heat sink
  • End launch, 2.9 mm, RF connectors
  • Through calibration path

Product Details

The ADPA7002-EVALZ evaluation board consists of a two-layer printed circuit board (PCB) fabricated from 10 mil thick, Rogers 4350 copper clad mounted to an aluminum heat sink. The heat sink assists in providing thermal relief to the device, as well as mechanical support to the PCB. Mounting holes on the heat sink allow attachment to larger heat sinks for improved thermal management. The RFIN and RFOUT ports are populated by 2.9 mm, female coaxial connectors and their respective RF traces are of 50 Ω characteristic impedance. The board is populated with components suitable for use over the entire operating temperature range of the device. To calibrate out board trace losses, a through calibration path is provided between J3 and J4. J3 and J4 must be populated with RF connectors to use the through calibration path. Power, ground, gate control voltages, and the detector output voltages are accessed through two 8-pin headers (see Table 1 for header pinout).

The RF traces are 50 Ω, grounded coplanar waveguide. The package ground leads and the exposed paddle directly connect to the ground plane. Multiple vias are used to connect the top and bottom ground planes, with particular focus on the area directly beneath the ground paddle, in order to provide adequate electrical conduction and thermal conduction to the heat sink.

The power supply decoupling capacitors on the evaluation board represent the configuration used to characterize and qualify the device. There can be scope to reduce the number of capacitors, but this varies from system to system. It is recommended to remove or combine the largest capacitors that are farthest from the device first.

For full details on the ADPA7002, see the ADPA7002 data sheet, which should be consulted in conjunction with this user guide when using these evaluation boards.

EVAL-ADPA7002
ADPA7002 Evaluation Board
ADPA7002AEHZ Evaluation Board ADPA7002AEHZ Evaluation Board ADPA7002AEHZ Evaluation Board

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