ADPA1116

• 2-layer Rogers 4350B evaluation board with heat spreader
• End launch, SMA, RF connectors
• Through calibration path (depopulated)

The ADPA1116-EVALZ is a 2-layer printed circuit board (PCB) fabricated from a 10 mil thick Rogers 4350B copper clad mounted to an aluminum heat spreader. The heat spreader provides thermal relief to the ADPA1116 and mechanical support to the PCB. Mounting holes on the heat spreader allow it to be attached to larger heatsinks for improved thermal management. The RFIN and RFOUT ports are populated by Subminiture Version A (SMA) female coaxial connectors, and their respective RF traces are of 50 Ω characteristic impedance. The ADPA1116-EVALZ is populated with components suitable for use over the entire operating temperature range of the ADPA1116.

The RF traces are 50 Ω grounded coplanar waveguide, and the package ground leads connect directly to the ground plane. Multiple vias are used to connect the top and bottom ground planes. Multiple vias under the package paddle ensure adequate electrical and thermal conduction.

The power supply decoupling capacitors shown in Figure 6 represent the configuration that was used to characterize the device. For full details on the ADPA1116, see the ADPA1116 data sheet, which should be consulted in conjunction with this user guide when using the ADPA1116-EVALZ evaluation board.