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µModule Regulators & DC-DC Modules
µModule Regulators & DC-DC Modules
Analog Devices' µModule® (micromodule) regulators and DC-to-DC Power Modules are highly integrated power management solutions offered as complete system-in-package (SiP) or system-on-module (SoM) designs. These products integrate DC-to-DC controllers, power transistors, input and output capacitors, compensation components, and inductors.
Our µModules power products are surface- mountable BGA or LGA packages or other compact module form factors, and support functions including step-down (buck), step-down and step-up (buck-boost), battery charging, isolated conversion, and LED driving. While DC-to-DC Power Module products include intermediate bus converter (IBC) modules, high-voltage DC/DC converter modules, and power block modules.
As highly integrated solutions with PCB Gerber files available for every device, these power products address time and space constraints while delivering high efficiency, reliability, and scalable high-capacity power delivery. Select µModule products additionally provide low-EMI performance compliant with EN 55022 Class B standards.
Our µModules power products are surface- mountable BGA or LGA packages or other compact module form factors, and support functions including step-down (buck), step-down and step-up (buck-boost), battery charging, isolated conversion, and LED driving. While DC-to-DC Power Module products include intermediate bus converter (IBC) modules, high-voltage DC/DC converter modules, and power block modules.
As highly integrated solutions with PCB Gerber files available for every device, these power products address time and space constraints while delivering high efficiency, reliability, and scalable high-capacity power delivery. Select µModule products additionally provide low-EMI performance compliant with EN 55022 Class B standards.
Analog Devices' µModule® (micromodule) regulators and DC-to-DC Power Modules are highly integrated power management solutions offered as complete system-in-package (SiP) or system-on-module (SoM) designs. These products integrate DC-to-DC controllers, power transistors, input and output capacitors, compensation components, and inductors.
Our µModules power products are surface- mountable BGA or LGA packages or other compact module form factors, and support functions including step-down (buck), step-down and step-up (buck-boost), battery charging, isolated conversion, and LED driving. While DC-to-DC Power Module products include intermediate bus converter (IBC) modules, high-voltage DC/DC converter modules, and power block modules.
As highly integrated solutions with PCB Gerber files available for every device, these power products address time and space constraints while delivering high efficiency, reliability, and scalable high-capacity power delivery. Select µModule products additionally provide low-EMI performance compliant with EN 55022 Class B standards.
Our µModules power products are surface- mountable BGA or LGA packages or other compact module form factors, and support functions including step-down (buck), step-down and step-up (buck-boost), battery charging, isolated conversion, and LED driving. While DC-to-DC Power Module products include intermediate bus converter (IBC) modules, high-voltage DC/DC converter modules, and power block modules.
As highly integrated solutions with PCB Gerber files available for every device, these power products address time and space constraints while delivering high efficiency, reliability, and scalable high-capacity power delivery. Select µModule products additionally provide low-EMI performance compliant with EN 55022 Class B standards.
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μModule Power Technology
μModule® power regulator technology simplifies implementation, verification, and manufacturing of complex power circuits by integrating the power function into one compact package. This system-in-package (SiP) approach streamlines the design process and reduces component count by minimizing the need to add external components.
μModule Power Technology
μModule® power regulator technology simplifies implementation, verification, and manufacturing of complex power circuits by integrating the power function into one compact package. This system-in-package (SiP) approach streamlines the design process and reduces component count by minimizing the need to add external components.
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