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μModule Power Technology

μModule® power regulator technology simplifies implementation, verification, and manufacturing of complex power circuits by integrating the power function into one compact package. This system-in-package (SiP) approach streamlines the design process and reduces component count by minimizing the need to add external components.

 

Value and Benefits

µModule® (micromodule) regulators and DC-to-DC power products are complete system-in-package (SiP) power management solutions with integrated DC-to-DC controllers, power transistors, input and output capacitors, compensation components, and inductors within a compact, surface-mount BGA or LGA package. µModule power technology supports functions such as step-down (buck), step-down and step-up (buck-boost), battery charger, isolated converter, and LED driver.


By integrating the power function in a compact package, µModule regulator products address time and space constraints for markets that require complex power technology, ranging from industrial automation and instrumentation to aerospace and communications.

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Simplifies design and implementation

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Compact for space constrained applications

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Minimizes the need for external components

Highly integrated solutions that reduce design time and PCB space concerns

Easy Implementation with Minimal External Components

Complete system-in-package (SiP) power management integrates the DC-to-DC controllers, power transistors, input and output capacitors, compensation components, and inductors into one device to deliver a reliable, high-efficiency, and low EMI noise power solution.

Ultrathin Package for Space Constrained Applications

The package height of the ultrathin µModule Regulator product family is 1.82mm or 1.91mm (LGA). This thin package allows placement on the backside of the PCB or under a common heat sink with digital devices such as FPGAs, GPUs, ASICs, and processors. These parts are also offered in a BGA package (0.6mm taller than LGA).

Standard Packaging Simplifies Design Layout

µModule power products are provided in BGA and LGA packages. The pad assignment of the package is uniform for easy PCB design. Both RoHS compliant and SnPb terminal finishes are available in the BGA package.

uModule Chip

Vertical and Lateral Power Solutions for AI Systems, Data Centers

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Assembly Considerations for µModule® BGA and LGA Packages

Discover a complete guide to:

  • Package Construction
  • PCB Design Guidelines
  • Moisture Sensitivity, Pack, Ship & Bake
  • Board Assembly Process

µModule LGA and BGA Packaging Care and Assembly Instructions

A brief reference on handling moisture sensitivity, reflow and assembly for the LGA and BGA packages



µModule Regulator Printed Circuit Board Design Guidelines

These guidelines provide insight into the process of designing the PCB layout for µModules




Package & Board Level Reliability

Analog Devices is committed to continuously improving its world-class product reliability levels and has some of the highest reliability standards in the industry



µModule LGA Packages

Outline drawings for LGA packages


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µModule BGA Packages

Outline drawings and information for BGA packages


µModule LGA Shipping Tray

Shipping Tray drawings and information for LGA packages

µModule BGA Shipping Tray

Shipping Tray drawings and information for BGA packages

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Solution Resources

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Developer Tools and Resources

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Improve the simulation of analog circuits with a powerful, fast, and free SPICE simulator software, schematic capture, and waveform viewer.

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Simulation Models

ADI provides simulation models for RF, Linear, Converters, Power Management and other products for circuit and board level simulation needs.

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