SSM2211

量产

低失真、1.5 W音频功率放大器

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产品详情

ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。

产品型号	引脚/封装图-中文版	文档	CAD 符号，脚注和 3D模型
SSM2211CPZ-REEL	8-Lead LFCSP (3mm x 3mm w/ EP)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
SSM2211CPZ-REEL7	8-Lead LFCSP (3mm x 3mm w/ EP)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
SSM2211SZ	8-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
SSM2211SZ-REEL	8-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
SSM2211SZ-REEL7	8-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys

产品型号	产品生命周期	PCN

7月 25, 2017 - 17_0068 CANCELLED: Addition of ASE Korea as an Alternate Assembly Site for Select 3x3mm and 4x4mm Body Sizes LFCSP Devices
		PCN17_0068_Form Material_Report Detailed Change Description Package Outline Drawing Qualification Results Summary
SSM2211CPZ-REEL	量产
SSM2211CPZ-REEL7	量产
2月 13, 2014 - 14_0038 Conversion of 3x3mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
		PCN14_0038_Form Material_Report Detailed Change Description Package Outline Drawing Qualification Report Summary
SSM2211CPZ-REEL	量产
SSM2211CPZ-REEL7	量产
2月 8, 2010 - 04_0080 Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
		PCN04_0080_Form Material_Report Reliability Report Reliability Report
SSM2211CPZ-REEL	量产
SSM2211CPZ-REEL7	量产
SSM2211SZ	量产
SSM2211SZ-REEL	量产
SSM2211SZ-REEL7	量产
11月 23, 2010 - 10_0004 Halogen Free Material Change for SOIC Narrow Body Products Assembled at Amkor
		PCN10_0004_Form Material_Report ADI0012 Reliability Report
SSM2211SZ	量产
SSM2211SZ-REEL	量产
SSM2211SZ-REEL7	量产

这是最新版本的数据手册