Analog Devices RF and microwave components are available as drop-in X-MWblocks^®
from Quantic^™ X-Microwave.

HMC361S8G

量产

使用InGaP HBT技术，2分频，采用SMT封装，DC - 10 GHz

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产品详情

ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。

产品型号	引脚/封装图-中文版	文档	CAD 符号，脚注和 3D模型
HMC361S8G	8-Lead SOIC w/ EP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
HMC361S8GE	8-Lead SOIC w/ EP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
HMC361S8GETR	8-Lead SOIC w/ EP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
HMC361S8GTR	8-Lead SOIC w/ EP	Material Declaration Reliablity Data	Ultra Librarian SamacSys

产品型号	产品生命周期	PCN

1月 29, 2021 - 21_0021 Correction of Package Outline Drawing for Select HMC Products in Carsem in the 8L SOIC E-Pad Package
		PCN21_0021_Form Material_Report Detailed Change Description
HMC361S8G	量产
HMC361S8GE	量产
HMC361S8GETR	量产
HMC361S8GTR	量产
5月 6, 2019 - 19_0063 Assembly Site Transfer of Select MSOP and SOIC_N E-pad Devices to Carsem Malaysia
		PCN19_0063_Form Material_Report Other Qualification Results Summary Qualification Results Summary Other
HMC361S8G	量产
HMC361S8GE	量产
HMC361S8GETR	量产
HMC361S8GTR	量产