DAC10
不推荐用于新设计10-Bit High Speed Multiplying D/A Converter (Universal Digital Logic Interface)
- 产品模型
- 7
产品详情
- Fast Settling: 85 ns
- Low Full-Scale Drift: 10 ppm/°C
- Nonlinearity to 0.05% Max Over Temperature Range
- Complementary Current Outputs: 0 mA to 4 mA
- Wide Range Multiplying Capability:
- 1 MHz Bandwidth
- Wide Power Supply Range:
- +5, -7.5 Min to ±18 V Max
- Direct Interface to TTL, CMOS,
- ECL, PMOS, NMOS
- Availability to DIE Form
The DAC10 series of 10-bit monolithic multiplying digital-to-analog converters provide high speed performance and full-scale accuracy. Advanced circuit design achieves 85 ns settling times with very low "glitch" energy and low power consumption. Direct interface to all popular logic families with full noise immunity is provided by the high swing, adjustable threshold logic inputs.
All DAC10 series models guarantee full 10-bit monotonicity, and nonlinearities as tight as +0.05% over the entire operating temperature range are available. Device performance is essentially unchanged over the ±18 V power supply range, with 85 mW power consumption attainable at lower supplies.
A highly stable, unique trim method is used, which selectively shorts Zener diodes, to provide 1/2 LSB full-scale accuracy without the need for laser trimming.
Single-chip reliability, coupled with low cost and outstanding flexibility, make the DAC10 device an ideal building block for A/D converters, Data Acquisition systems, CRT displays, programmable test equipment and other applications where low power consumption, input/output versatility and long-term stability are required.
参考资料
ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。
产品型号 | 引脚/封装图-中文版 | 文档 | CAD 符号,脚注和 3D模型 |
---|---|---|---|
DAC10FX | 18-Lead CerDIP | ||
DAC10GBCG:69 | CHIPS OR DIE | ||
DAC10GPZ | 18-Lead PDIP | ||
DAC10GSZ | 18-Lead SOIC (Wide) | ||
DAC10GSZ-REEL | 18-Lead SOIC (Wide) | ||
DAC10NBCG:69 | CHIPS OR DIE | ||
DAC10NTBCG:69 | CHIPS OR DIE |
产品型号 | 产品生命周期 | PCN |
---|---|---|
11月 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
||
DAC10FX | ||
11月 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
||
DAC10FX | ||
11月 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
||
DAC10FX | ||
DAC10GPZ | 量产 | |
DAC10GSZ | 量产 | |
DAC10GSZ-REEL | 量产 | |
3月 7, 2019 - 19_0046 Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek |
||
DAC10GPZ | 量产 | |
8月 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
||
DAC10GPZ | 量产 | |
9月 9, 2022 - 22_0148 Assembly Site Transfer for 18L SOIC_W Products |
||
DAC10GSZ | 量产 | |
DAC10GSZ-REEL | 量产 | |
2月 7, 2011 - 10_0003 Halogen Free Material Change for SOIC Wide Body Products Assembled at Amkor |
||
DAC10GSZ | 量产 | |
DAC10GSZ-REEL | 量产 |
这是最新版本的数据手册
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