LT1009

量产

2.5V 基准

数据手册产品选型表

产品模型: 13

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产品详情

点击这里获取军用性能 (JAN Class S) 器件数据表 —— 您将被指引至美国国防部哥伦布供应中心的产品数据表。
最大初始容差：0.2%
保证温度稳定性
0.6Ω 最大动态阻抗
宽工作电流范围
可与 LM136 直接互换以改善性能
无需针对最小温度系数进行调节
采用 8 引脚 SO 和 MSOP 封装以及 3 引脚 TO-92 封装

产品模型: 13

参考资料

ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。

产品型号	引脚/封装图-中文版	文档	CAD 符号，脚注和 3D模型
5962-8961001XA	3-Lead TO-46	Material Declaration Reliablity Data	Ultra Librarian SamacSys
LT1009CDICE	CHIPS OR DIE	Material Declaration Reliablity Data	Ultra Librarian SamacSys
LT1009CDICE#MILDICE	CHIPS OR DIE	Material Declaration Reliablity Data	Ultra Librarian SamacSys
LT1009CMS8#PBF	8-Lead MSOP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
LT1009CMS8#TRPBF	8-Lead MSOP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
LT1009CZ#PBF	3-Lead TO-92	Material Declaration Reliablity Data	Ultra Librarian SamacSys
LT1009CZ#TRPBF	3-Lead TO-92	Material Declaration Reliablity Data	Ultra Librarian SamacSys
LT1009IS8#PBF	8-Lead SOIC (Narrow 0.15 Inch)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
LT1009IS8#TRPBF	8-Lead SOIC (Narrow 0.15 Inch)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
LT1009IZ#PBF	3-Lead TO-92	Material Declaration Reliablity Data	Ultra Librarian SamacSys
LT1009IZ#TRPBF	3-Lead TO-92	Material Declaration Reliablity Data	Ultra Librarian SamacSys
LT1009S8#PBF	8-Lead SOIC (Narrow 0.15 Inch)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
LT1009S8#TRPBF	8-Lead SOIC (Narrow 0.15 Inch)	Material Declaration Reliablity Data	Ultra Librarian SamacSys

产品型号	产品生命周期	PCN

8月 30, 2022 - 22_0196 Test Site Transfer of RH, SMD, Class-S, Special Flow, MIL-STD-883 Products from Analog Devices Milpitas to ADGT
		PCN22_0196_Form Material_Report Qualification Results Summary Qualification Results Summary Qualification Results Summary Test Correlation Report Test Correlation Report Test Correlation Report Other
5962-8961001XA	量产
3月 4, 2022 - 22_0025 Implement Laser Top Mark for TO Metal Can Packages Assembled in Team Pacific Corporation.
		PCN22_0025_Form Material_Report Detailed Parts List
5962-8961001XA	量产	PCN22_0025_Form Material_Report Detailed Parts List
10月 11, 2022 - 22_0244 Epoxy Change from Henkel 8290 to 8290A for MSOP Package
		PCN22_0244_Form Material_Report Qualification Results Summary Delta Qualification Matrix
LT1009CMS8#PBF	量产
LT1009CMS8#TRPBF	量产
2月 3, 2020 - 20_0128 Laser Top Mark for 8 Lead MSOP Packages Assembled in ADPG and UTAC
		PCN20_0128_Form Material_Report
LT1009CMS8#PBF	量产
LT1009CMS8#TRPBF	量产
2月 20, 2022 - 22_0014 Final Packaging Changes for TO-92, TO-5 and TO-46
		PCN22_0014_Form Material_Report Other
LT1009CZ#PBF	量产
LT1009IZ#PBF	量产
3月 6, 2022 - 22_0014 Final Packaging Changes for TO-92, TO-5 and TO-46
		PCN22_0014_Form Material_Report Other
LT1009CZ#TRPBF	量产
LT1009IZ#TRPBF	量产
10月 12, 2022 - 22_0254 Epoxy Change from Henkel 8290 to 8290A for 8-Lead SOIC Package (PCN part 1 of 2)
		PCN22_0254_Form Material_Report Qualification Results Summary Delta Qualification Matrix
LT1009IS8#PBF	量产
LT1009IS8#TRPBF	量产
LT1009S8#PBF	量产
LT1009S8#TRPBF	量产
6月 11, 2021 - 21_0060 Laser Top Mark for 8SOICN Assembled in ADPG, UTL and CRM
		PCN21_0060_Form Material_Report Delta Qualification Matrix
LT1009IS8#PBF	量产
LT1009IS8#TRPBF	量产
LT1009S8#PBF	量产
LT1009S8#TRPBF	量产