MAX20317
PRODUCTIONUniversal 3.5mmØ Accessory Management IC
A Universal Jack Interface Solution with Wide the Power Management and Interface Control of Accessory
- Part Models
- 2
- 1ku List Price
- Starting From $0.96
Part Details
- Allows Wide Range of Applications by Supporting Universal 3.5mm Jack Types
- Auto-Configuration for CTIA and OMTP Headsets
- Supports MEMS Microphone
- 50mΩ Ground Switch
- Enables Long Utilization of Accessories by Supplying Power Through 3.5mm Jack
- Powered Accessory/Headset Detection
- Bypass Switch to Power Accessories, Such as ANC Headsets
- Programmable Button Detection in Powered Accessory Mode
- Empowers New Path in Data Communication to Accessories
- Power Line Communication by 3.5mm Jack
- Bidirectional Digital Data Communication in Power Mode
- Allow Emergence of New Accessory Types
- Provides Comfortable Sounds by Introducing Automatic Volume Adjustment
- Adaptive Volume Control Based on Precision Headset Impedance
- False Insertion Detection
- Saves Board Space with Small Form Factor
- 1.65mm x 2.05mm 4 x 5 Array 20-Bump 0.4mm Pitch WLP
The MAX20317 is an I2C controllable, universal 3.5mmØ accessory management IC. The device provides a universal jack interface solution, as well as a compact solution for the power management and interface control of a powered accessory, such as an active noise cancelling (ANC) headset.
The MAX20317 automatically measures headset impedance with a high precision, triple current source 8 bit ADC. After impedance detection, the device also detects when a headset is in a CTIA or OMTP configuration and automatically configures the SLEEVE and RING2 terminals to correctly connect the microphone and ground lines.
When a boost supply is applied, the MAX20317 can detect the presence of an ANC headset. When the ANC headset is detected and enabled, a button-press monitoring circuit activates and flags button presses by detecting the voltage drop across a sense resistor.
The MAX20317 provides a power line communication tool to a headset to exchange the data with the host device.
The MAX20317 has the two separate ground sense inputs from the SLEEVE and RING2 terminals of the connector to provide a high ground isolation to the audio codec.
The MAX20317 is available in a space-saving, 20-bump, 0.4mm pitch, 1.65mm x 2.05mm wafer-level package (WLP) and operates over the -40°C to +85°C extended temperature range.
Applications
- Notebook PCs
- Phablet
- Smart Phones
- Tablet PCs
Documentation
Data Sheet 1
Reliability Data 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| MAX20317EWP+ | 20-WLCSP-N/A | ||
| MAX20317EWP+T | 20-WLCSP-N/A |
This is the most up-to-date revision of the Data Sheet.
Evaluation Kits
Evaluation Kit for the MAX20317