HMC722LP3E
PRODUCTION13 Gbps, Fast Rise Time AND/NAND/OR/NOR Gate, with Programmable Output Voltage
- Part Models
- 2
- 1ku List Price
- price unavailable
Part Details
- Supports High Data Rates: up to 13 Gbps
- Differential & Singe-Ended Operation
- Fast Rise and Fall Times: 19/18 ps
- Low Power Consumption: 230 mW typ.
- Programmable Differential
Output Voltage Swing: 600 - 1100 mV - Propagation Delay: 95 ps
- See datasheet for additional features
The HMC722LP3E is an AND/NAND/OR/NOR function designed to support data transmission rates of up to 13 Gbps, and clock frequencies as high as 13 GHz. The HMC772LP3E may be easily configured to provide any of the following logic functions: AND, NAND, OR and NOR. The HMC722LP3E also features an output level control pin, VR, which allows for loss compensation or for signal level optimization.
All input signals to the HMC722LP3E are terminated with 50ω to ground on-chip, and may be either AC or DC coupled. The differential outputs of the HMC722LP3E may be either AC or DC coupled. Outputs can be connected directly to a 50ω to ground terminated system, while DC blocking capacitors may be used if the terminating system is 50ω to a non-ground DC voltage. The HMC722LP3E operates from a single -3.3V DC supply, and is available in a RoHS compliant 3 × 3 mm SMT package.
APPLICATIONS
- RF ATE Applications
- Broadband Test & Measurement
- Serial Data Transmission up to 13 Gbps
- Digital Logic Systems up to 13 GHz
- NRZ-to-RZ Conversion
Documentation
Data Sheet 1
Product Selection Guide 1
Quality Documentation 4
Tape & Reel Specification 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| HMC722LP3E | 16-Lead QFN (3mm x 3mm w/ EP) | ||
| HMC722LP3ETR | 16-Lead QFN (3mm x 3mm w/ EP) |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Apr 19, 2022 - 22_0048 Addition of ASE Korea as an Alternate Assembly Site for Select LFCSP Products |
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| HMC722LP3E | PRODUCTION | |
| HMC722LP3ETR | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.