ADSP-BF707
PRODUCTIONLow Power 400MHz Blackfin+ Embedded Processor with 1MByte L2 SRAM & DDR2/LPDDR Interface
- Part Models
- 5
- 1ku List Price
- Starting From $10.30
Part Details
- Blackfin+ core with up to 400 MHz performance
- Dual 16-bit or single 32-bit MAC support per cycle
- 16-bit complex MAC and many other instruction set enhancements
- Instruction set compatible with previous Blackfin products
- On-Chip Memory
- 136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad)
- 1MByte on-chip L2 SRAM with ECC protection
- 512KByte On-chip L2 ROM
- L3 interface providing 16-bit interface to DDR2 or LPDDR SDRAM devices (up to 200 MHz)
- Key Peripherals include
- USB2.0 HS OTG
- 2x CAN2.0B
- ePPI Video I/O
- 2x SPORTs (w/I2S)
- 2xQuad-SPI / 1xDual-SPI (w/ Host mode option)
- I2C
- 2xUART
- SD/SDIO/MMC (8-bit)
- 4-ch 12-bit 1MSPS ADC
- Security and one-time-programmable memory
- Crypto hardware accelerators for fast secure boot/IP protection
- memDMA encryption/decryption for fast run-time security
- Low-cost packaging
- 184-Ball CSP_BGA package (12 mm × 12mm × 0.8mm pitch), RoHS compliant
- Low system power with < 100 mW at 400 MHz (< 0.25 mW/MHz) at 25°C TJUNCTION
This device is a member of the ADSP-BF70x Blackfin Digital Signal Processor (DSP) product family. The new Blackfin+ processor core combines dual-MAC 16-bit, 32-bit MAC and 16-bit complex MAC in to a state-of-the-art signal processing engine. It also combines advantages of a clean, orthogonal RISC-like microprocessor instruction set, and single-instruction, multiple-data (SIMD) multimedia capabilities within a single instruction-set architecture. Further new enhancements to the Blackfin+ core add cache enhancements, branch prediction and other instruction set improvements—all while maintaining instruction set compatibility to previous Blackfin products.
The processor offers performance up to 400 MHz, as well as lowest power consumption at <100mW. Produced with a low-power and low-voltage design methodology, they provide world-class power management and performance.
By integrating a rich set of industry-leading system peripherals, large on-chip memory & a high speed external memory interface, this Blackfin processor is the platform of choice for next-generation applications that require RISC-like programmability, multimedia support, and leading-edge signal processing in one integrated package. These applications span a wide array of markets, from automotive systems to embedded industrial, instrumentation, video/image analysis, biometric and control applications.
Documentation
Data Sheet 1
User Guide 3
Application Note 12
Technical Articles 1
Processor Manual 3
Product Highlight 1
Emulator Manual 2
Integrated Circuit Anomaly 1
Informational 1
Video 7
Product Highlight 1
Webcast 2
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADSP-BF707BBCZ-3 | 184-Ball CSPBGA (12mm x 12mm x 1.7mm) | ||
| ADSP-BF707BBCZ-4 | 184-Ball CSPBGA (12mm x 12mm x 1.7mm) | ||
| ADSP-BF707BBCZ-4RL | 184-Ball CSPBGA (12mm x 12mm x 1.7mm) | ||
| ADSP-BF707KBCZ-3 | 184-Ball CSPBGA (12mm x 12mm x 1.7mm) | ||
| ADSP-BF707KBCZ-4 | 184-Ball CSPBGA (12mm x 12mm x 1.7mm) |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Jan 23, 2024 - 23_0268 Bond Wire Conversion and Mold Compound Change for ADSP-BF70x/BF70xW Processors in 184-Ball BGA Package |
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| ADSP-BF707BBCZ-3 | PRODUCTION | |
| ADSP-BF707BBCZ-4 | PRODUCTION | |
| ADSP-BF707BBCZ-4RL | PRODUCTION | |
| ADSP-BF707KBCZ-3 | PRODUCTION | |
| ADSP-BF707KBCZ-4 | PRODUCTION | |
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Jul 19, 2017 - 17_0134 ADSP-BF70x Data Sheet Update |
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| ADSP-BF707BBCZ-3 | PRODUCTION | |
| ADSP-BF707BBCZ-4 | PRODUCTION | |
| ADSP-BF707KBCZ-3 | PRODUCTION | |
| ADSP-BF707KBCZ-4 | PRODUCTION | |
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Jun 22, 2016 - 16_0103 Die Revision 1.1 for ADSP-BF70x Blackfin Processor Products |
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| ADSP-BF707BBCZ-3 | PRODUCTION | |
| ADSP-BF707BBCZ-4 | PRODUCTION | |
| ADSP-BF707KBCZ-3 | PRODUCTION | |
| ADSP-BF707KBCZ-4 | PRODUCTION | |
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Sep 25, 2015 - 15_0181 Data Sheet change for ADSP-BF70x |
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| ADSP-BF707BBCZ-3 | PRODUCTION | |
| ADSP-BF707BBCZ-4 | PRODUCTION | |
| ADSP-BF707KBCZ-3 | PRODUCTION | |
| ADSP-BF707KBCZ-4 | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
Software Resources
Middleware 1
CrossCore® Embedded Studio
CCES is a world-class integrated development environment (IDE) for the ADI Blackfin®, SHARC® and Arm® processor families.
View DetailsEvaluation Software 0
Tools & Simulations
Evaluation Kits
The ADZS-BF707 Blackfin Low-power Imaging Platform (BLIP) evaluation hardware provides a low-cost hardware solution for evaluating vision platform targeting a vast array of real-time sensing applications.
The ADSP-BF707 EZ-Kit Lite evaluation hardware provides a low-cost hardware solution for evaluating the ADSP-BF70x Blackfin+ processor family.
Resources
Low Cost ICE-1000 and High Performance ICE-2000 USB-based JTAG Emulators
Radar Demonstration Platform. Evaluates Radar chipset including the ADF5901, ADF5904 and ADF4159.
Features and Benefits
This evaluation board is obsolete and no longer recommended. The replacement board is the TinyRad Demonstration Platform.
- Out-of-the-box Radar demonstration platform.
- Evaluates 24GHz Radar chipset
- Antenna to bits functionality.
- Accompanying software GUI to evaluate:
- FMCW
- Range Doppler
- Digital Beam Forming.
Product Details
The 24 GHz radar sensor platform called Demorad is a novel microwave radar evaluation platform solution with out-of-the-box software examples and easy startup of radar sensor all done within minutes. Demorad platform enables rapid product prototyping aimed at R&D interests in investigating radar and developing radar sensor products that can measure real-time information such as target/object presence, its movement, angular position, velocity, and range from the sensor.
The Demorad platform provides both hardware and software that allows for very fast evaluation and development of 24 GHz radar without the need to have RF microwave and signal chain system expertize, and significantly reduces development time and system expertize during product development phases.
A high performance RF and analog full signal chain including DSP processing, that is, an RF to bits solution is provided that allows for flexible processing on raw acquisition data, allowing radar experiments on a state-of-the art level hardware in a very short time.
Full software support of 24 GHz radar ICs using a software graphical user interface (GUI) and in DSP radar support function libraries with added capability to write raw data for post processing on PC using Matlab tools.
Figure 1. Demorad 24GHz Evaluation Software Window showing Range-Doppler mode.
Demorad Details
The Demorad uses ADI’s 24 GHz, multichannel radar solution. The sensor consists of a single PCB with 2 transmitter/4 receiver antennas on the front side connected to the 24 GHz RF chipset and data acquisition ADC’s and DSP on the reverse side. This forms the basis for a reference design that customers can use to build their final product design.
Figure 2. Demorad full signal chain.
The Demorad uses FMCW radar to detect range and velocity of objects up to 200 m away with a resolution of approximately 75 cm. The field of view (FOV) is approximately 120° in azimuth and 15° in elevation based on the antenna array design. By combining antennas as used in digital beam forming (DBF), the Demorad uses DBF to calculate angular information in the FOV.
Figure 3. Demorad system setup.
Applications
- Traffic monitoring and car parking
- UAV/drone collision avoidance and altimeters
- Monitoring and security systems