ADP3334

NOT RECOMMENDED FOR NEW DESIGNS

High Accuracy Low I_Q, 500 mA anyCAP^® Adjustable Low Dropout Regulator

Data Sheet (Rev. C) Product Selection Table

Part Models: 5
1ku List Price: Starting From $1.11

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Part Details

High Accuracy over Line and Load: ±0.9% @ 25°C, ±1.8% over Temperature
500 mA Current Capability
Ultralow Dropout Voltage
Requires Only C_O = 1.0 µF for Stability
anyCAP = Stable with Any Type of Capacitor (Including MLCC)

Current and Thermal Limiting
Low Noise
Low Shutdown Current: < 1.0 µA (Typ)
2.6 V to 11 V Supply Range
1.5 V to 10 V Output Range
-40°C to +85°C Ambient Temperature Range

Part Models: 5
1ku List Price: Starting From $1.11

Documentation

Frequently Asked Question 1

FAQ 06/17/2015

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
ADP3334ACPZ-REEL7	8-Lead LFCSP (3mm x 3mm)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADP3334ARMZ-REEL7	8-Lead MSOP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADP3334ARZ	8-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADP3334ARZ-REEL	8-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADP3334ARZ-REEL7	8-Lead SOIC	Material Declaration Reliablity Data	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Jul 25, 2017 - 17_0068 CANCELLED: Addition of ASE Korea as an Alternate Assembly Site for Select 3x3mm and 4x4mm Body Sizes LFCSP Devices
		PCN17_0068_Form Material_Report Detailed Change Description Package Outline Drawing Qualification Results Summary
ADP3334ACPZ-REEL7	PRODUCTION
Apr 24, 2014 - 14_0038 Conversion of 3x3mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
		PCN14_0038_Form Material_Report Detailed Change Description Package Outline Drawing Qualification Report Summary
ADP3334ACPZ-REEL7	PRODUCTION
Sep 10, 2012 - 11_0020 Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to StatsChippac Malaysia.
		PCN11_0020_Form Material_Report Detailed Change Description Package Outline Drawing Qualification Report Summary
ADP3334ACPZ-REEL7	PRODUCTION
Jan 5, 2015 - 14_0246 Qualification of ASE Chungli, as an Alternate Assembly Site for Select MSOP Devices
		PCN14_0246_Form Material_Report Detailed Change Description Qualification Results Summary
ADP3334ARMZ-REEL7	PRODUCTION
May 15, 2012 - 10_0006 Halogen Free Material Change for mini SOIC Products
		PCN10_0006_Form Material_Report Qualification Report Summary Qualification Report Summary
ADP3334ARMZ-REEL7	PRODUCTION

This is the most up-to-date revision of the Data Sheet.

Hardware Ecosystem

Parts	Product Life Cycle	Description
ADP7104	RECOMMENDED FOR NEW DESIGNS	20 V, 500 mA, Low Noise, CMOS LDO

Tools & Simulations

ADI Linear Regulator Design Tool and Parametric Search

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