ADE8167

Obsolete

Power-Line Communications Master Modem IC

Data Sheet (Rev. SpA) Product Selection Table

Part Models: 2
1ku List Price: price unavailable

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Part Details

Narrow-band power-line communications IC
- Integrates physical, data link and networking layers
Application layer
- Supports DL/T 645-1997 or -2007 data protocol (specific to China), as well as a passthrough option
Networking layer
- Automatic baud rate negotiation
- Dynamic Routing
Data link layer
- CRC Checking
- Network key for data security

Physical layer
- FSK modulation
- Up to 2400 bps on a 3-phase network
Simple serial interface to host microprocessor
Single 3.3V supply, low power (140mW typical)
Package and temperature range
- 40-lead 6 mm × 6 mm LFCSP
- Fully specified for −40°C to +85°C operation

Part Models: 2
1ku List Price: price unavailable

Documentation

Obsolete Data Sheet 1

ADE8167: Power Line Communications Master Modem IC Obsolete Data Sheet (Rev.SpA) 10/31/2011

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
ADE8167ACPZ-02	LFCSP:LEADFRM CHIP SCALE	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADE8167ACPZRL-02	LFCSP:LEADFRM CHIP SCALE	Material Declaration Reliablity Data	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

May 23, 2014 - 13_0232 Assembly and Test Transfer of Select 6x6 and 7x7mm LFCSP Products to STATS ChipPAC China
		PCN13_0232_Form Material_Report Detailed Change Description Qualification Results Summary Test Correlation Report
ADE8167ACPZ-02	Obsolete
ADE8167ACPZRL-02	Obsolete

This is the most up-to-date revision of the Data Sheet.

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