AD648S

PRODUCTION

Aerospace Dual Precision, Low Power BiFET Op Amp

Data Sheet Product Selection Table

Part Models: 5
1ku List Price: price unavailable

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Part Details

DC Performance:
Quiescent Current: 400 µA Max
Bias Current: 10pA Max
Noise: 2µV p-p typical, 0.1 to 10Hz

AC Performance:
Slew Rate: 1.8V/µs typical
Unity Gain Bandwidth: 1MHz typical

Part Models: 5
1ku List Price: price unavailable

Documentation

Data Sheet 2

AD648S: Military Data Sheet 08/11/2020

AD648S: Dual Precision,Low Power BiFET Op Amp DIE Data Sheet 08/07/2020

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
5962-9753501VGA	8 ld Header	Material Declaration Reliablity Data	Ultra Librarian SamacSys
5962-9753501VPA	8-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
5962-9753502VGA	8 ld Header	Material Declaration Reliablity Data	Ultra Librarian SamacSys
5962-9753502VPA	8 ld Header	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD648-000C	CHIPS OR DIE	Material Declaration Reliablity Data	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Sep 29, 2022 - 22_0195 Shipment Carrier Change for TO-99 Header Package
		PCN22_0195_Form Material_Report Qualification Results Summary
5962-9753501VGA
5962-9753502VGA
Jul 30, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
		PCN16_0026_Form Material_Report Qualification Results Summary
5962-9753501VGA
5962-9753501VPA
5962-9753502VGA
5962-9753502VPA
Nov 18, 2015 - 15_0219 Laser Marking Standardization for Aerospace Packages
		PCN15_0219_Form Material_Report Qualification Results Summary
5962-9753501VGA
5962-9753501VPA
5962-9753502VGA
5962-9753502VPA
Oct 2, 2013 - 13_0163 Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices
		PCN13_0163_Form Material_Report Qualification Plan Summary
5962-9753501VGA
5962-9753501VPA
5962-9753502VGA
5962-9753502VPA
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
		PCN11_0050_Form Material_Report
5962-9753501VGA
5962-9753501VPA
5962-9753502VGA
5962-9753502VPA
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
		PCN11_0182_Form Material_Report
5962-9753501VGA
5962-9753501VPA
5962-9753502VGA
5962-9753502VPA
Nov 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
		PCN12_0199_Form Material_Report Qualification Report Summary Datasheet Specification Comparison
5962-9753501VPA
5962-9753502VPA
Feb 9, 2009 - 08_0073 Change of Seal Glass Material for Cerdip & Cerpak Packages
		08_0073AQualPlan Material_Report PCN08_0073_Form
5962-9753501VPA
5962-9753502VPA

This is the most up-to-date revision of the Data Sheet.

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