HMC723LP3E
PRODUCTION13 Gbps Fast Rise Time D-Type Flip-Flop with Programmable Output Voltage
- Part Models
- 2
- 1ku List Price
- price unavailable
Part Details
- Supports High Data Rates: up to 13 Gbps
- Differential & Singe-Ended Operation
- Fast Rise & Fall Times: 19/17 ps
- Low Power Consumption: 260 mW typ.
- Programmable Differential Output Voltage Swing: 700 - 1300 mV
- Propagation Delay: 105 ps
- Single Supply: -3.3V
- 16 Lead 3×3mm
SMT Package: 9mm2
The HMC723LP3E is a D-type Flip Flop designed to support data transmission rates of up to 13 Gbps, and clock frequencies as high as 13 GHz. During normal operation, data is transferred to the outputs on the positive edge of the clock. Reversing the clock inputs allows for negative-edge triggered applications. The HMC723LP3E also features an output level control pin, VR, which allows for loss compensation or for signal level optimization.
All input signals to the HMC723LP3E are terminated with 50 Ohms to ground on-chip, and maybe either AC or DC coupled. The differential outputs of the HMC723LP3E may be either AC or DC coupled. Outputs can be connected directly to a 50 Ohm to ground terminated system, while DC blocking capacitors may be used if the terminating system is 50 Ohms to a non-ground DC voltage. The HMC723LP3E operates from a single -3.3V DC supply and is available in a RoHS compliant 3x3 mm SMT package.
APPLICATIONS
- RF ATE Applications
- Broadband Test & Measurement
- Serial Data Transmission up to 13 Gbps
- Digital Logic Systems up to 13 GHz
Documentation
Data Sheet 1
Quality Documentation 4
Product Selection Guide 1
Tape & Reel Specification 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| HMC723LP3E | 16-Lead QFN (3mm x 3mm w/ EP) | ||
| HMC723LP3ETR | 16-Lead QFN (3mm x 3mm w/ EP) |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Mar 29, 2023 - 22_0048 Addition of ASE Korea as an Alternate Assembly Site for Select LFCSP Products |
||
| HMC723LP3E | PRODUCTION | |
| HMC723LP3ETR | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
Tools & Simulations
IBIS Model 1
Evaluation Kits
HMC723LP3E Evaluation Board