设计、搭建、测试
图示的电路板已装配完成且经过测试。

概览

设计资源

设计与集成文件

  • Schematic
  • Bill of Materials
  • PCB Layout Files
  • Test Results
  • FAB Assemly Files
  • 下载设计文件 4.53 M
  • 评估硬件

    产品型号带"Z"表示符合RoHS标准。评估此电路需要下列选中的电路板

    • MAXREFDES171# ($260.70) EV Kit
    查询库存和在线购买

    器件驱动器

    软件(如C代码和/或FPGA代码等)用于与元件的数字接口通信。

    MAX32660 GitHub no-OS Driver Source Code

    描述

    Introduction

    Advanced factory automation solutions, such as Industry 4.0, require increasing numbers of smart sensors, which are typically controlled using IO-Link® for the point-to-point serial communication between the sensor and controller (master). As a leading provider of IO-Link sensor transceiver and master transceiver ICs, Maxim also provides complete reference design solutions to help our customers improve their time to market. These proven designs cover all of the hardware and software requirements needed for compliance with the IO-Link standard. The complete reference design, including all of the ICs and external protection devices such as TVS diodes, is provided on a 30mm x 7.5mm printed circuit board (PCB).

    Maxim Integrated and Technologie Management Gruppe Technologie und Engineering (TMG TE) collaborated in designing the MAXREFDES171 as a reference design that is compliant with the IO-Link version 1.1/1.0 standard. The MAXREFDES171 design consists of an industry-standard MAX22513 IO-Link device transceiver, a MAX32660 ultra-low-power 16-bit microcontroller utilizing the TMG TE IO-Link device stack, and a commercially available VL53L1 distance sensor.

    优势和特点

    • IEC 61131-9
    • TMG TE IO-Link Stack
    • IO-Link version 1.1 compliant
    • Measures Distances up to 4m

    详情

    支持与培训

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