ADG506A

不推荐用于新设计

16通道多路复用器（DG506A的出色替代器件）

数据手册 (Rev. C) 产品选型表

产品模型: 9

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产品详情

最大额定电源电压：44 V
模拟信号范围：V_SS 至 V_DD
单/双电源供电
宽电源电压范围：10.8 V至16.5 V

扩展塑性温度范围：
-40°C至+85°C
低功耗：28 µW（最大值）
低泄漏：20 pA（典型值）
DG506A/HI-506的绝佳替代器件
28引脚DIP/SOIC/PLCC/LCCC/TSSOP封装

参考资料

ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。

产品型号	引脚/封装图-中文版	文档	CAD 符号，脚注和 3D模型
ADG506ABQ	28-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG506AKNZ	28-Lead PDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG506AKPZ	28-Lead PLCC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG506AKPZ-REEL	28-Lead PLCC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG506AKRZ	28-Lead SOIC (Wide)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG506AKRZ-REEL	28-Lead SOIC (Wide)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG506ATE/883B	28 ld LCC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG506ATQ	28-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
ADG506ATQ/883B	28-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys

产品型号	产品生命周期	PCN

11月 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
		PCN12_0199_Form Material_Report Qualification Report Summary Datasheet Specification Comparison
ADG506ABQ
ADG506ATQ
ADG506ATQ/883B	量产
11月 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
		PCN11_0050_Form Material_Report
ADG506ABQ
ADG506ATE/883B
ADG506ATQ
ADG506ATQ/883B	量产
11月 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
		PCN11_0182_Form Material_Report
ADG506ABQ
ADG506ATE/883B
ADG506ATQ
ADG506ATQ/883B	量产
3月 7, 2019 - 19_0046 Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
		PCN19_0046_Form Material_Report Detailed Change Description Qualification Results Summary
ADG506AKNZ
8月 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
		Material_Report Material_Report Parts List PCN07_0024_Form Qual Data
ADG506AKNZ
8月 4, 2010 - 10_0117 Halogen Free Material Change for SOIC_W Products at Carsem
		PCN10_0117_Form Material_Report Reliability Report
ADG506AKRZ	量产
ADG506AKRZ-REEL	量产
4月 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
		PCN16_0026_Form Material_Report Qualification Results Summary
ADG506ATE/883B
ADG506ATQ/883B	量产
2月 1, 2010 - 10_0020 Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility.
		Material_Report PCN10_0020_Form Qual Plan
ADG506ATE/883B
ADG506ATQ/883B	量产

这是最新版本的数据手册

硬件生态系统

部分模型	产品周期	描述
ADG1206	量产	低电容、16通道、±15 V/12 V iCMOS™多路复用器
ADG5206	推荐新设计使用	高压防闩锁型16通道多路复用器

ADG506A

产品详情

参考资料

数据手册 2

应用笔记 3

技术文章 3

产品选型指南 1

硬件生态系统

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