High Temperature Operating Life (HTOL), Failures in Time (FIT), Mean Time to Fail (MTTF).
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Process Technology Data Search Results
ADI Overall Life-Test Data Summary | |
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Calculations assumes 0.7 eV Activation Energy | |
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Values are displayed at 60% and 90% confidence levels based on standard operating temperature. The summary table will recalculate values when a different operating temperature is entered.
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ADI Overall Life-Test Data Summary | |
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Overall Sample Size | 445576 |
Qty. Fail | 0 |
Equivalent Device Hrs. @ 55 deg C | 72503111445 |
FIT Rate (60% CL, 55 deg C) | 0.01 |
MTTF (60% CL, 55 deg C) in Hrs in Hrs | 079126817323 |
FIT Rate (90% CL, 55 deg C) | 0.03 |
MTTF (90% CL, 55 deg C) in Hrs | 31487770868 |
Calculations assumes 0.7 eV Activation Energy |
HTOL Temperature (deg C) | Duration (hrs) | Generic | Date Code | Process Technology | Sample Size | Qty Fail | Failure Mechanism |
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Please note: Where a device of interest is not sampled, it is valid to use the reliability data of the particular process technology to which the part belongs, since all parts within the same family are designed to the same rules and manufacturing as controlled by SPC.
The data provided in this calculation is generic data that reflects the overall reliability of the Wafer Fabrication Technology grouping for the selected product. The data may have been collected on the product selected or other Analog Devices products manufactured using the same technology grouping.
The data is intended to provide a high-level assessment of the reliability of the fabrication process used to manufacture a given product or products. Analog Devices products should never be operated outside the specified datasheet limits and this data should never be used as an indication of the Reliability of a product outside of those specified data sheet limits.